J. Bartha

T. Mikolajick, J. Bartha, M. Knaut, 2018, 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC).

Plasma-enhanced chemical vapor deposition of amorphous Si on graphene

C. Wenger, J. Bartha, C. Strobel, 2016, 1605.05099.

High efficiency high rate microcrystalline silicon thin-film solar cells deposited at plasma excitation frequencies larger than 100 MHz

J. Bartha, J. Kuske, C. Strobel, 2015 .

Low‐thermal budget flash light annealing for Al2O3 surface passivation

T. Mikolajick, T. Henke, F. Fengler, 2015 .

Time-resolved layer thickness behavior of microcrystalline and amorphous silicon samples after switching on a hydrogen/silane VHF plasma

J. Bartha, M. Albert, A. Kottwitz, 2002 .

3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating

C. Wenzel, J. Bartha, M. Albert, 2019, Microelectronic Engineering.

SiGe channels for higher mobility CMOS devices

P. Kücher, M. Trentzsch, T. Herrmann, 2009 .

Temperature dependence of the sticking coefficients of bis-diethyl aminosilane and trimethylaluminum in atomic layer deposition

J. Bartha, M. Oettel, Timo Schössler, 2017 .

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP

J. Bartha, R. Rzehak, B. Vasilev, 2013 .

Novel Graphene Adjustable-Barrier Transistor with Ultra-High Current Gain.

T. Mikolajick, A. Jahn, J. Bartha, 2022, ACS applied materials & interfaces.

Influence of Additive Coadsorption on Copper Superfill Behavior

J. Bartha, R. Liske, A. Preusse, 2009 .

Physical characterization of thin ALD–Al2O3 films

Uwe Schroeder, Johann W. Bartha, G. Dollinger, 2003 .

Crystallization behavior of thin ALD-Al2O3 films

Harald Seidl, Uwe Schroeder, Johann W. Bartha, 2003 .

CHEMICAL INTERACTIONS AT METAL-POLYMER INTERFACES.

G. Rubloff, P. Ho, P. Hahn, 1984 .

Method to determine the sticking coefficient of precursor molecules in atomic layer deposition

J. Bartha, M. Rose, 2009 .

Remote plasma etching of titanium nitride using NF3/argon and chlorine mixtures for chamber clean applications

Johann W. Bartha, Matthias Albert, B. Hintze, 2007 .

Electrical properties of electroplated Cu(Ag) thin films

S. Strehle, J. Bartha, K. Wetzig, 2009 .

Epitaxial growth of Xe on the Si(111) 7 × 7 surface observed by leed

J. Bartha, M. Henzler, 1985 .

Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures

S. Menzel, S. Strehle, A. Jahn, 2009 .

Microstructure of electroplated Cu(Ag) alloy thin films

S. Menzel, S. Strehle, J. Bartha, 2011 .

Atomic layer deposited high-κ nanolaminates for silicon surface passivation

T. Mikolajick, J. Bartha, M. Knaut, 2014 .

Atomic Layer Deposition for Coating of High Aspect Ratio TiO2 Nanotube Layers

J. Macák, J. Přikryl, L. Hromádko, 2016, Langmuir : the ACS journal of surfaces and colloids.

Focusing hard x rays beyond the critical angle of total reflection by adiabatically focusing lenses

Christian Wenzel, Christian G. Schroer, Karola Richter, 2017 .

Molecular orbital analysis of the XPS spectra of PMDA‐ODA polymide and its polyamic acid precursor

J. Clabes, B. Silverman, J. Bartha, 1986 .

Characterization of barrier and seed layer integrity for copper interconnects

J. Bartha, D. Lehninger, H. Wojcik, 2011, 2011 Semiconductor Conference Dresden.

Doped organic transistors operating in the inversion and depletion regime

Hans Kleemann, Karl Leo, Björn Lüssem, 2013, Nature Communications.

Damascene technique applied to surface acoustic wave devicesa)

Juergen Thomas, H. Schmidt, J. Bartha, 2007 .

Investigation of erosion plume emission spectra by laser ablation of metallic targets in vacuum

Christian Wenzel, Oleg Alexeyevic Novodvorsky, Rafael Ya. Sagdeev, 2002, International Conference on Laser and Laser Information Technologies.

Water uptake of a low-κ dielectric film: Combining capacitance and gravimetric measurements

Johann W. Bartha, J. Bartha, C. Kubasch, 2013 .

Inline deposition of microcrystalline silicon solar cells using a linear plasma source

T. Zimmermann, A. Flikweert, A. Gordijn, 2010 .

Monitoring atomic layer deposition processes in situ and in real-time by spectroscopic ellipsometry

Johann W. Bartha, Marcel Junige, Matthias Albert, 2011, 2011 Semiconductor Conference Dresden.

Anisotropy of thermal expansion of thin polyimide films

J. Bartha, H. H. Wagner, G. Elsner, 1990 .

In-situ analysis on the initial growth of ultra-thin ruthenium films with atomic layer deposition

J. Bartha, M. Albert, Marion Geidel, 2013 .

In-situ real-time ellipsometric investigations during the atomic layer deposition of ruthenium: A process development from [(ethylcyclopentadienyl)(pyrrolyl)ruthenium] and molecular oxygen

Johann W. Bartha, Marcel Junige, Matthias Albert, 2012 .

TSV Transistor—Vertical Metal Gate FET Inside a Through Silicon VIA

J. Bartha, K. Richter, F. Winkler, 2018, IEEE Electron Device Letters.

Temperature dependence of the reflectivity of silicon with surface oxide at wavelengths of 633 and 1047 nm

J. W. Bartha, A. C. Tam, A. Tam, 1999 .

Erosion plume characteristics determination in ablation of metallic copper, niobium, and tantalum targets

Oleg Alexeyevic Novodvorsky, Olga D. Khramova, Elena O. Filippova, 2003, Other Conferences.

Thickness dependent barrier performance of permeation barriers made from atomic layer deposited alumina for organic devices

T. Mikolajick, U. Schroeder, P. Schmidt, 2015 .

Copper-Based TSV: Interposer

J. Bartha, S. Killge, V. Neumann, 2016 .

Controlling threshold voltage and leakage currents in vertical organic field-effect transistors by inversion mode operation

K. Leo, J. Bartha, M. Sawatzki, 2015 .

Electroplating of Cu(Ag) thin films for interconnect applications

S. Menzel, S. Strehle, J. Bartha, 2010 .

Growth of aluminum oxide thin films with enhanced film density by the integration of in situ flash annealing into low-temperature atomic layer deposition

T. Henke, J. Bartha, M. Albert, 2017 .

Influence of growth temperature on physical properties of ZnO films produced by pulsed laser deposition method

C. Wenzel, F. Lebedev, J. Bartha, 2013 .

Graphene based electron field emitter

Christian Wenger, Mirko Fraschke, Johann W. Bartha, 2015 .

Current Modulation of a Heterojunction Structure by an Ultra-Thin Graphene Base Electrode

C. Wenger, A. Di Bartolomeo, J. Bartha, 2018, Materials.

Low temperature etching of Si in high density plasma using SF6/O2

Johann W. Bartha, J. Greschner, J. Bartha, 1995 .

Formation of regularly arranged large grain silicon islands by using embedded micro mirrors in the flash crystallization of amorphous silicon

R. Hübner, T. Henke, J. Bartha, 2014 .

Fourier Transform Infrared Spectroscopy of Moisturized Low- $\kappa$ Dielectric Materials

J. W. Bartha, U. Mayer, H. Ruelke, 2011, IEEE Transactions on Electron Devices.

Influence of Al/sub 2/O/sub 3/ dielectrics on the trap-depth profiles in MOS devices investigated by the charge-pumping method

S. Jakschik, A. Avellan, U. Schroeder, 2004, IEEE Transactions on Electron Devices.

Temperature dependence of the sticking coefficient in atomic layer deposition

Johann W. Bartha, J. Bartha, I. Endler, 2010 .

A CMP Model Including Global Distribution of Pressure

S Bott, R Rzehak, B Vasilev, 2011, IEEE Transactions on Semiconductor Manufacturing.

In situ reaction mechanism studies on ozone-based atomic layer deposition of Al(2)O(3) and HfO(2).

Johann W. Bartha, Mikko Ritala, M. Ritala, 2010, ACS applied materials & interfaces.

Integration of molecular-layer-deposited aluminum alkoxide interlayers into inorganic nanolaminate barriers for encapsulation of organic electronics with improved stress resistance

Karl Leo, Thomas Mikolajick, Uwe Schroeder, 2015 .

Atomic layer deposition of Al2O3 on NF3-pre-treated graphene

Christian Wenger, Grzegorz Lupina, Johann W. Bartha, 2015, Microtechnologies for the New Millennium.

Investigation of Moisture Uptake in Low-κ

Hartmut Ruelke, Ulrich Mayer, Johann W. Bartha, 2010 .

Electrical characterisation of HfYO MIM-structures deposited by ALD

J. Bartha, M. Albert, J. Gluch, 2010 .

A comparative study of thermal and plasma enhanced ALD Ta-N-C films on SiO2, SiCOH and Cu substrates

J. Bartha, M. Albert, H. Wojcik, 2007, 2007 IEEE International Interconnect Technology Conferencee.

Direct plasma-enhanced atomic layer deposition of aluminum nitride for water permeation barriers

J. Bartha, M. Albert, M. Knaut, 2020 .

Alternative etching gases to SF6 for plasma enhanced chamber cleaning in silicon deposition systems

J. Bartha, M. Albert, R. Terasa, 2005 .

Fast backscattering parameter determination in e-beam lithography with a modified doughnut test

Katja Keil, Marc Hauptmann, Kang-Hoon Choi, 2009 .

Atomic Layer Deposition for Coating of High Aspect Ratio TiO2 Nanotube Layers

J. Macák, J. Přikryl, J. Bartha, 2016, Langmuir : the ACS journal of surfaces and colloids.

Atomic Layer Deposition of Titanium Dioxide Thin Films from Cp*Ti(OMe)3 and Ozone

Johann W. Bartha, Lutz Wilde, Paweł Piotr Michałowski, 2009 .

Modeling and characterization of optical TSVs

Ronny Henker, Frank Ellinger, Dirk Plettemeier, 2017, Other Conferences.

Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems

Frank Ellinger, Zhipeng Zhang, Robert Weigel, 2017, 2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS).