Yiwen Song

发表

Local measurements of domain wall-induced self-heating in released PbZr0.52Ti0.48O3 films

S. Trolier-McKinstry, C. Fragkiadakis, J. S. Lundh, 2020 .

Interdependence of Electronic and Thermal Transport in AlxGa1–xN Channel HEMTs

T. Beechem, V. Gopalan, A. Allerman, 2020, IEEE Electron Device Letters.

Multidimensional thermal analysis of an ultrawide bandgap AlGaN channel high electron mobility transistor

T. Beechem, V. Gopalan, A. Allerman, 2019, Applied Physics Letters.

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

A. Allerman, A. Baca, Hyungtak Kim, 2020, Journal of Electronic Packaging.

Enhancement of the Electrical and Thermal Performance of AlGaN/GaN HEMTs Using a Novel Resistive Field Plate Structure

Tae Kyoung Kim, J. Kwak, D. Shoemaker, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Characterization of the Thermal Boundary Resistance of a Ga2O3/4H-SiC Composite Wafer

C. McGray, Yiwen Song, Sukwon Choi, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Ultra-Wide Bandgap Ga$_2$O$_3$-on-SiC MOSFETs

C. McGray, S. Krishnamoorthy, Yiwen Song, 2022, 2210.07417.

Electro-thermal co-design of β-(AlxGa1-x)2O3/Ga2O3 modulation doped field effect transistors

C. McGray, S. Rajan, S. Krishnamoorthy, 2020, Applied Physics Letters.

Growth-microstructure-thermal property relations in AlN thin films

T. Beechem, Chi Zhang, J. Maria, 2022, Journal of Applied Physics.

Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and Beyond.

T. Beechem, J. Maria, S. Trolier-McKinstry, 2021, ACS applied materials & interfaces.

The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates

J. Maria, D. Ji, T. Borman, 2020 .

Ga2O3-on-SiC Composite Wafer for Thermal Management of Ultrawide Bandgap Electronics.

C. McGray, J. Maria, D. Shoemaker, 2021, ACS applied materials & interfaces.

Thermal Conductivity of β-Phase Ga2O3 and (AlxGa1-x)2o3 Heteroepitaxial Thin Films.

J. Maria, A. Baca, S. Badescu, 2021, ACS applied materials & interfaces.

Thermal conductivity of plasma-enhanced atomic layer deposited hafnium zirconium oxide dielectric thin films

Jihyun Kim, J. An, Yiwen Song, 2021 .

Ultra-Wide Band Gap Ga2O3-on-SiC MOSFETs.

C. McGray, S. Krishnamoorthy, Yiwen Song, 2023, ACS applied materials & interfaces.

Table of Contents Graphic Ultra-Wide Bandgap Ga2O3-on-SiC MOSFETs

S. Krishnamoorthy, Yiwen Song, Sukwon Choi, 2023 .

130 mA / mm β-Ga 2 O 3 MESFET with Low-Temperature MOVPE-Regrown Ohmic Contacts

D. Shoemaker, S. Krishnamoorthy, Yiwen Song, 2021 .

130 mA mm−1 β-Ga2O3 metal semiconductor field effect transistor with low-temperature metalorganic vapor phase epitaxy-regrown ohmic contacts

D. Shoemaker, S. Krishnamoorthy, J. S. Lundh, 2021 .

Polycrystalline diamond growth on β-Ga2O3 for thermal management

Chao Yuan, D. Snyder, J. S. Lundh, 2021, Applied Physics Express.

Cumulative Impacts of Proton Irradiation on the Self-heating of AlGaN/GaN HEMTs

Hyungtak Kim, D. Shoemaker, I. Jovanovic, 2020 .

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

A. Allerman, A. Baca, Hyungtak Kim, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Polarity Manipulation of Anomalous Hall Effect and Enhanced Spin-Orbit Torques in Perpendicular Synthetic Antiferromagnets

Yiwen Song, Zongzhi Zhang, Qingyuan Jin, 2023, Physical Review Applied.

Characterization of GaN-on-SiC Wafers using a Multi-Method Laser-Based Pump-Probe Technique

S. Sheppard, Yiwen Song, Sukwon Choi, 2023, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers

C. Nordquist, Yiwen Song, Sukwon Choi, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.