H. Oppermann

发表

4.3 Μm Quantum Cascade Detector in Pixel Configuration References and Links

M. N. Kutty, H. Herzig, Niblack, 2022 .

Prototype ATLAS IBL modules using the FE-I4A front-end readout chip

M. Cavalli-Sforza, A. Clark, S. Dube, 2012 .

Electromigration in electroplated gold micro contacts

H. Reichl, G. Engelmann, H. Oppermann, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Interlayer cooling potential in vertically integrated packages

H. Rothuizen, H. Reichl, T. Brunschwiler, 2008 .

Flip chip assembly of thinned chips for hybrid pixel detector applications

Oswin Ehrmann, Kai Zoschke, M. Rothermund, 2014 .

Wafer level 3D system integration based on silicon interposers with through silicon vias

I. Ndip, K. Zoschke, K. Lang, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

T. Braun, O. Ehrmann, K. Zoschke, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Low cost wafer-level 3-D integration without TSV

Herbert Reichl, Thomas Fritzsch, Matthias Klein, 2009, 2009 59th Electronic Components and Technology Conference.

Thin film substrate technology and FC interconnection for very high frequency applications

H. Reichl, M. Topper, K. Scherpinski, 2006, 56th Electronic Components and Technology Conference 2006.

Investigation of low temperature bonding process using indium bumps

K. Lang, O. Ehrmann, M. Rothermund, 2018, Journal of Instrumentation.

Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application

B. Wunderle, D. May, H. Oppermann, 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing

B. Wunderle, D. May, H. Oppermann, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Thermo-mechanical simulation of sintered Ag die attach for high temperature applications

K. Lang, H. Walter, H. Oppermann, 2014 .

Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding

K. Zoschke, K. Lang, H. Oppermann, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

A miniature timing microsystem using two silicon resonators

K. Zoschke, J. Baborowski, T. Pensala, 2013, 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC).

Parameterized models for a RF chip-to-substrate interconnect

Li Li, Werner John, Lih-Tyng Hwang, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach

B. Michel, B. Wunderle, H. Oppermann, 2011 .

RF Modeling and Measurement of a Novel Aperture-Coupled Hybrid Glass-Silicon 5G Antenna Array

Thi Huyen Le, H. Reichl, I. Ndip, 2021, European Conference on Antennas and Propagation.

3D Process Integration – Requirements and Challenges

P. Ramm, H. Reichl, K. Zoschke, 2008 .

Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging

K. Zoschke, K. Lang, P. Mackowiak, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding

K. Zoschke, K. Lang, M. Kaynak, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems

K. Lang, R. Fiederling, O. Ehrmann, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)

Klaus-Dieter Lang, Christian Ehrhardt, Matthias Hutter, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test

B. Wunderle, D. May, H. Oppermann, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

The Role of Au/Sn Solder in Packaging

H. Oppermann, H. Oppermann, 2005 .

The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures

A. Mavinkurve, Roland Fiederling, H. Willwohl, 2013 .

Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

Yannick Baumgartner, Nikos Pleros, Tolga Tekin, 2021, Applied Sciences.

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$ W RTC Mode and Programmable HF Clocks

Charles Alix Manier, Kai Zoschke, Hermann Oppermann, 2013, IEEE Journal of Solid-State Circuits.

A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

Charles Alix Manier, Kai Zoschke, Hermann Oppermann, 2013, 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers.

Forced convective interlayer cooling in vertically integrated packages

H. Reichl, B. Wunderle, B. Michel, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Packaging of radiation and particle detectors

H. Reichl, O. Ehrmann, M. Topper, 2006, 56th Electronic Components and Technology Conference 2006.

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Klaus-Dieter Lang, Kai Zoschke, David Ruffieux, 2016, 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Wafer level packaging for hermetical encapsulation of MEMS resonators

K. Zoschke, H. Oppermann, J. Dekker, 2015, 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Vacuum packaging at wafer level for MEMS using gold-tin metallurgy

K. Zoschke, H. Oppermann, J. Dekker, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

D. Ruffieux, K. Zoschke, H. Oppermann, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration

F. Krismer, B. Michel, J. Kolar, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

3D image sensor SiP with TSV silicon interposer

K. Zoschke, H Reichl, H. Oppermann, 2009, 2009 59th Electronic Components and Technology Conference.

3D Silicon Photonics Interposer for Tb/s Optical Interconnects in Data Centers with Double-Side Assembled Active Components and Integrated Optical and Electrical Through Silicon Via on SOI

Xin Yin, Christian Neumeyr, Tolga Tekin, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Fabrication of a High Precision Magnetic Position Sensor Based on a Through Silicon Via First Approach

K. Zoschke, H. Oppermann, M. Saumer, 2018, 2018 International Wafer Level Packaging Conference (IWLPC).

Development of a High Resolution Magnetic Field Position Sensor System Based on a Through Silicon Via First Integration Concept

K. Zoschke, H. Oppermann, M. Saumer, 2018, Electronic Components and Technology Conference.

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

D. Ruffieux, K. Zoschke, H. Oppermann, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Via last technology for direct stacking of processor and flash

K. Zoschke, H. Oppermann, M. J. Wolf, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling

O. Ehrmann, K. Zoschke, M. Topper, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Advanced Flip Chip Technologies

H. Reichl, R. Aschenbrenner, H. Oppermann, 1999, 29th European Solid-State Device Research Conference.