J. Major
发表
S. Santhanagopalan,
Kae Fink,
Drew J. Pereira,
2021,
Energy Storage Materials.
Joseph P. Kozak,
J. Major,
J. Kozak,
2018
.
Khai D.T. Ngo,
Joseph P. Kozak,
K. Ngo,
2018,
2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
Om Prakash Yadav,
Douglas DeVoto,
Anunay Gupta,
2018,
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
B. Polzin,
M. Keyser,
J. Vaughey,
2022,
Journal of Power Sources.
C. Dimarino,
J. Major,
D. DeVoto,
2022,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
C. Dimarino,
J. Major,
S. Gage,
2021,
2021 IEEE Applied Power Electronics Conference and Exposition (APEC).
Darshan G. Pahinkar,
S. Narumanchi,
J. Major,
2022,
Microelectronics Reliability.
Xuhui Feng,
S. Narumanchi,
S. Shen,
2018,
Nano letters (Print).
S. Narumanchi,
J. Major,
D. DeVoto,
2020,
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Darshan G. Pahinkar,
S. Narumanchi,
J. Major,
2019,
Journal of Electronic Packaging.
Andrew M. Colclasure,
M. Keyser,
Nathaniel Sunderlin,
2023,
Journal of Energy Storage.
J. Major,
J. Meth,
G. Blackman,
2017,
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
G. Lu,
S. Narumanchi,
J. Major,
2022,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
J. Lehr,
D. Ginley,
K. Heinselman,
2022,
2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA).
Xuhui Feng,
S. Narumanchi,
J. Major,
2019,
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT).
S. Narumanchi,
F. Khan,
J. Major,
2023,
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).