V. Gupta
发表
J. Yuan,
V. Gupta,
J. H. Yuan,
1993
.
G. T. Hahn,
C. Rubin,
V. Gupta,
1992
.
G. T. Hahn,
C. Rubin,
V. Gupta,
1995
.
G. T. Hahn,
C. Rubin,
V. Gupta,
1993
.
G. T. Hahn,
C. Rubin,
V. Gupta,
1996
.
G. T. Hahn,
C. Rubin,
V. Gupta,
1994
.
J. Jansen,
V. Gupta,
K. van Dijk,
1998,
Journal of biomedical materials research.
R. C. Picu,
V. Gupta,
1996
.
V. Prasad,
S. Sampath,
V. Gupta,
2001
.
I. Parinov,
V. Chebanenko,
E. Rozhkov,
2017
.
Samit Roy,
V. Gupta,
L. Dharani,
2001
.
Samit Roy,
V. Gupta,
L. Dharani,
2001
.
Samit Roy,
V. Gupta,
L. Dharani,
2000
.
K. Lu,
P. Ho,
D. Edwards,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
V. Gupta,
G. Subbarayan,
D. Chan,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Gupta,
Ron Zhang,
G. Subbarayan,
2009,
IEEE Transactions on Electronics Packaging Manufacturing.
V. Gupta,
G. Subbarayan,
D. Bhate,
2008,
IEEE Transactions on Components and Packaging Technologies.
G. Subbarayan,
V. Gupta,
I. Dutta,
2008,
2008 10th Electronics Packaging Technology Conference.
D. Chan,
G. Subbarayan,
V. Gupta,
2010,
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
V. Gupta,
P. Hundt,
2007,
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.
R. Cairncross,
V. Gupta,
R. Knight,
2006
.
V. Gupta,
S. Roy,
L. Dharani,
2004
.
Zhigang Suo,
V. Gupta,
A. S. Argon,
1992
.
R. Cairncross,
V. Gupta,
R. Knight,
2006,
International Thermal Spray Conference.
V. Gupta,
D. Edwards,
D. Edwards,
2009,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
V. Gupta,
D. Edwards,
Jie-Hua Zhao,
2008,
IEEE Transactions on Electronics Packaging Manufacturing.
V. Gupta,
T. Choudhary,
K. Khas,
2021,
Strength of Materials.
V. Gupta,
S. Ravindran,
A. Tessema,
2019,
Experimental Mechanics.
Nicos Martys,
Josephine H. Cheung,
Chiara F. Ferraris,
2007
.
R. Cairncross,
V. Gupta,
R. Knight,
2006
.
J. Zhao,
D. Bhate,
D. Chan,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.