T. Kurahashi

Four-wavelength silicon hybrid laser array with ring-resonator based mirror for efficient CWDM transmitter

Tomoyuki Akiyama, Shinsuke Tanaka, Shigeaki Sekiguchi, 2013, 2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC).

High-output-power, single-wavelength silicon hybrid laser using precise flip-chip bonding technology.

Shinsuke Tanaka, Seok-Hwan Jeong, S. Sekiguchi, 2012, Optics express.

Flip-chip-bonded, 8-wavelength AlGaInAs DFB laser array operable up to 70°C for silicon WDM interconnects

S. Sekiguchi, M. Matsuda, A. Uetake, 2014, 2014 The European Conference on Optical Communication (ECOC).

SOA-Integrated Silicon Photonics Switch and Its Lossless Multistage Transmission of High-Capacity WDM Signals

Takashi Inoue, Shu Namiki, Keijiro Suzuki, 2019, Journal of Lightwave Technology.

A 1 V Peak-to-Peak Driven 10-Gbps Slow-Light Silicon Mach--Zehnder Modulator Using Cascaded Ring Resonators

Teruo Kurahashi, Tatsuya Usuki, Nobuaki Hatori, 2010 .

Heterogeneous Integration of Microwave GaN Power Amplifiers With Si Matching Circuits

N. Kurahashi, Masaru Sato, N. Okamoto, 2017, IEEE Transactions on Semiconductor Manufacturing.

Characteristics of aluminum substitution technology for self-aligned full metal gate nMOSFETs

S. Nakamura, T. Kurahashi, Y. Mishima, 2005, IEEE Transactions on Electron Devices.

In-line Optical Amplification for Silicon Photonics Platform by Flip-Chip Bonded InP-SOAs

K. Tanizawa, S. Sekiguchi, A. Uetake, 2018, 2018 Optical Fiber Communications Conference and Exposition (OFC).

Cascaded-ring-resonator-loaded Mach–Zehnder modulator for enhanced modulation efficiency in wide optical bandwidth

Ken Morito, Teruo Kurahashi, Tatsuya Usuki, 2012 .

1-Vpp 10-Gb/s operation of slow-light silicon Mach-Zehnder modulator in wavelength range of 1 nm

N. Hatori, T. Kurahashi, S. Akiyama, 2010, 7th IEEE International Conference on Group IV Photonics.

Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding

Ken Tanizawa, Keijiro Suzuki, Kazuhiro Ikeda, 2019, Journal of Lightwave Technology.

Characteristics of Al substituted nanowires fabricated by self-aligned growth for future large scale integration interconnects

T. Kurahashi, H. Kudo, 2011 .

Lossless Operation of SOA-Integrated Silicon Photonics Switch for 8 × 32-Gbaud 16-QAM WDM Signals

S. Namiki, S. Sekiguchi, A. Uetake, 2018, 2018 Optical Fiber Communications Conference and Exposition (OFC).