U. Zschenderlein

发表

M. Wolf, B. Wunderle, R. Dudek, 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

T. Brunschwiler, B. Wunderle, G. Schlottig, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

B. Wunderle, D. May, U. Zschenderlein, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Xi Chen, T. Brunschwiler, B. Wunderle, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

B. Wunderle, U. Zschenderlein, J. Arnold, 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

P. Ramm, B. Wunderle, U. Zschenderlein, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

D. N. Wright, Astrid-Sofie B. Vardøy, T. Brunschwiler, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

D. N. Wright, T. Brunschwiler, B. Wunderle, 2018, 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

P. Ramm, B. Wunderle, E. Auerswald, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Klaus Pressel, Bernhard Wunderle, Jens Heilmann, 2017, Microelectron. Reliab..