J. Arnold

Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data

M. Wolf, B. Wunderle, R. Dudek, 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Button Shear Fatigue Test: Fracture-Mechanical Interface Characterisation under Periodic Subcritical Mechanical Loading

B. Wunderle, J. Arnold, M. Shaygi, 2019, 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Acceleration of lifetime modeling by isothermal bending fatigue tests

B. Wunderle, J. Heilmann, J. Arnold, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications

B. Wunderle, U. Zschenderlein, J. Arnold, 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Accelerated Pump Out Testing for Thermal Greases

B. Wunderle, D. May, J. Heilmann, 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation

B. Wunderle, D. May, J. Heilmann, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases

B. Wunderle, D. May, J. Heilmann, 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).