Ronald J. Gutmann

发表

Differential and operational amplifiers

William D. Becher, Gerold W. Neudeck, Ronald J. Gutmann, 1978 .

Wafer-Level 3D Integration for ULSI Interconnects

Jian-Qiang Lu, Ronald J. Gutmann, 2009 .

Wafer-Level 3D Integration Technology Platforms for ICs and MEMS

Jian-Qiang Lu, J. J. McMahon, Ronald J. Gutmann, 2005 .

Microwave-Detected Photoconductivity-Transient Spectroscopy For Non-Destructive Evaluation Of Gaas Wafers

Ronald J. Gutmann, Michael Heimlich, J. M. Borrego, 1987, Other Conferences.

Wafer-Level Via-First 3D Integration with Hybrid-Bonding of Cu/BCB Redistribution Layers

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2005 .

Integrated power electronics modules for 400 V/10 A motor-drive applications using flip-chip flex-circuit technology

Thomas M. Jahns, Ronald J. Gutmann, Z. Parrilla, 2003, IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03..

Wafer-level 3D system-on-a-chip using dielectric glue wafer bonding and Cu damascene inter-wafer interconnects

Russell P. Kraft, J. J. McMahon, Ronald J. Gutmann, 2003 .

Flip-chip flex-circuit packaging for 42 V/16 A integrated power electronics module applications

R. Natarajan, Ronald J. Gutmann, E. J. Rymaszewski, 2002, APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335).

Shunt-mounted harmonically-tuned power rectifier for distributed power converters

Ronald J. Gutmann, J. M. Borrego, D. P. Garrison, 1993, 1993 IEEE MTT-S International Microwave Symposium Digest.

Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2004 .

Antimonide-based devices for thermophotovoltaic applications

Ronald J. Gutmann, Ishwara B. Bhat, G. W. Charache, 1999 .

Photoeffects in common-source and common-drain microwave GaAs MESFET oscillators

Ronald J. Gutmann, J. M. Borrego, H. J. Sun, 1981 .

Role of relative tilt on the structural properties of GaInSb epitaxial layers grown on (001) GaSb substrates

Ronald J. Gutmann, Ishwara B. Bhat, G. W. Charache, 1999 .

P-type and N-type doping in GaSb and Ga{sub 0.8}In{sub 0.2}Sb layers grown by metalorganic vapor phase epitaxy

Ronald J. Gutmann, Ishwara B. Bhat, G. W. Charache, 1998 .

Low-temperature silicon wafer bonding based on Ti∕Si solid-state amorphization

Jian-Qiang Lu, Ronald J. Gutmann, R. Gutmann, 2006 .

Chemical Mechanical Planarization of Microelectronic Materials

Ronald J. Gutmann, Shyam P. Murarka, Joseph M. Steigerwald, 1997 .

Radiation Effects on GaAs MESFETs

Ronald J. Gutmann, Jose M. Borrego, Sanjay B. Moghe, 1978, IEEE Transactions on Nuclear Science.

Damascene copper interconnects with polymer ILDs

Ronald J. Gutmann, Shyam P. Murarka, D. T. Price, 1997 .

Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures

Ronald J. Gutmann, Shyam P. Murarka, D. T. Price, 1994 .

Growth and characterization of In{sub 0.2}Ga{sub 0.8}Sb device structures using metalorganic vapor phase epitaxy

Ronald J. Gutmann, Ishwara B. Bhat, G. W. Charache, 1997 .

Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2006 .

Evaluation of BCB Bonded and Thinned Wafer Stacks for Three-Dimensional Integration

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2008 .

Three-dimensional wafer-scale copper chemical–mechanical planarization model

Sadasivan Shankar, Lei Jiang, Ronald J. Gutmann, 2002 .

Copper/Benzocyclobutene Interconnects for Sub‐100 nm Integrated Circuit Technology: Elimination of High‐Resistivity Metallic Liners and High‐Dielectric Constant Polish Stops

Ronald J. Gutmann, Shyam P. Murarka, Jan M. Neirynck, 1999 .

Chemical processes in the chemical mechanical polishing of copper

Ronald J. Gutmann, David J. Duquette, Shyam P. Murarka, 1995 .

Silicon nitride chemical mechanical polishing mechanisms

Ronald J. Gutmann, T. P. Chow, R. Gutmann, 1998 .

p-Type and n-type doping in GaSb and Ga0.8In0.2Sb layers grown by metalorganic vapor phase epitaxy

Ronald J. Gutmann, Ishwara B. Bhat, G. W. Charache, 1998 .

Design considerations and experimental analysis for silicon carbide power rectifiers

Ronald J. Gutmann, V. Khemka, Tat-Sing Paul Chow, 1999 .

Thermal stresses in 3D IC inter-wafer interconnects

Jing Zhang, Jian-Qiang Lu, Ronald J. Gutmann, 2005 .

Thermal Cycling Effects on Critical Adhesion Energy and Residual Stress in Benzocyclobutene-Bonded Wafers

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2005 .

Three-Dimensional Chemical Mechanical Planarization Slurry Flow Model Based on Lubrication Theory

Ronald J. Gutmann, Donald W. Schwendeman, William N. Gill, 2001 .

Inverse analysis of material removal data using a multiscale CMP model

Ronald J. Gutmann, John A. Tichy, Timothy S. Cale, 2003 .

p‐type GaSb and Ga0.8In0.2Sb layers grown by metalorganic vapor phase epitaxy using silane as the dopant source

Ronald J. Gutmann, Ishwara B. Bhat, H. Ehsani, 1996 .

Critical Adhesion Energy at the Interface Between Benzocyclobutene and Silicon Nitride Layers

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2007 .

Exploration of the Scaling Limits of 3D Integration

Jian-Qiang Lu, Robert E. Jones, Ronald J. Gutmann, 2006 .

Critical Adhesion Energy of Benzocyclobutene-Bonded Wafers

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2006 .

Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2006 .

Characteristics of GaSb and GaInSb layers grown by metalorganic vapor phase epitaxy

Ronald J. Gutmann, Ishwara B. Bhat, J. M. Borrego, 1995 .

Ternary and quaternary antimonide devices for thermophotovoltaic applications

Ronald J. Gutmann, Ishwara B. Bhat, G. W. Charache, 1998 .

Recombination processes in doubly capped antimonide-based quaternary thin films

Ronald J. Gutmann, G. W. Charache, J. M. Borrego, 1999 .

Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2005 .

An investigation of the chemical mechanical polishing of copper thin films to form in-laid interconnections in the dielectric (SiO/sub 2/) films

Ronald J. Gutmann, David J. Duquette, Shyam P. Murarka, 1995, Proceedings of the Eleventh Biennial University/Government/ Industry Microelectronics Symposium.

Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers

Jian-Qiang Lu, Ronald J. Gutmann, J. J. McMahon, 2006 .

Thermally induced stresses in 3D-IC inter-wafer interconnects: A combined grain-continuum and continuum approach

Jian-Qiang Lu, Ronald J. Gutmann, Max O. Bloomfield, 2007 .

3D Integration Based upon Dielectric Adhesive Bonding

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2008 .

Bulk crystal growth of antimonide based III-V compounds for TPV applications

Ronald J. Gutmann, P. S. Dutta, A. G. Ostrogorsky, 1999 .

Integration of copper multilevel interconnects with oxide and polymer interlevel dielectrics

Ronald J. Gutmann, T. Paul Chow, Shyam P. Murarka, 1995 .

Pad porosity, compressibility and slurry delivery effects in chemical- mechanical planarization: modeling and experiments

Ronald J. Gutmann, Donald W. Schwendeman, William N. Gill, 2000 .

Gallium Nitride Power Device Design Tradeoffs

Ronald J. Gutmann, Kevin Matocha, T. Paul Chow, 2002 .

Effect of leakage current on the power output of s band TRAPATT oscillators

H. J. Geipel, Ronald J. Gutmann, J. M. Borrego, 1974 .

Surface Kinetics Model for SiLK Chemical Mechanical Polishing

Ronald J. Gutmann, William N. Gill, Christopher L. Borst, 2002 .

Copper-Fundamental Mechanisms for Microelectronic Applications

Ronald J. Gutmann, Shyam P. Murarka, R. Gutmann, 2000 .

Chemical Mechanical Planarization—An Introduction

Ronald J. Gutmann, Shyam P. Murarka, Joseph M. Steigerwald, 2007 .

Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

Ronald J. Gutmann, Shyam P. Murarka, Joseph M. Steigerwald, 1993 .

CMP Compatibility of Partially Cured Benzocyclobutene (BCB) for a Via-First 3D IC Process

Jian-Qiang Lu, Ronald J. Gutmann, Frank Niklaus, 2005 .

Performance Limits of Low Bandgap Thermophotovoltaic Antimonide-Based Cells for Low Temperature Radiators

Ronald J. Gutmann, Ishwara B. Bhat, P. F. Baldasaro, 2000 .

Low-Temperature Titanium-Based Wafer Bonding Ti ∕ Si , Ti ∕ SiO 2 , and Ti ∕ Ti

Jian-Qiang Lu, Ronald J. Gutmann, R. Gutmann, 2007 .

Dielectric GlueWafer Bonding For 3D ICs

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2003 .

Copper Metallization Needs for Wafer-Level, Three-Dimensional Integration

Jian-Qiang Lu, Rafael Reif, Kuan-Neng Chen, 2006 .

Stacked chip-to-chip interconnections using wafer bonding technology with dielectric bonding glues

Russell P. Kraft, Jian-Qiang Lu, Ronald J. Gutmann, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Polymer Adhesive Bonding Technology

Ronald J. Gutmann, James J.-Q. Lu, Tim S. Cale, 2008 .

3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces

Jian-Qiang Lu, Ronald J. Gutmann, J. McMahon, 2008 .

Chemical‐Mechanical Polishing of Parylene N and Benzocyclobutene Films

Ronald J. Gutmann, Yiping Zhao, Jan M. Neirynck, 1997 .

Die-on-Wafer and Wafer-Level Three-Dimensional (3D) Integration of Heterogeneous IC Technologies for RF-Microwave-Millimeter Applications

Jian-Qiang Lu, Ronald J. Gutmann, S. Devarajan, 2004 .

Rensselaer 3D Integration Processes

Ronald J. Gutmann, James J.-Q. Lu, Tim S. Cale, 2008 .