F. Shi

发表

Yongzhi He, Yuan-Chang Lin, N. Tran, 2006, 2006 International Microsystems, Package, Assembly Conference Taiwan.

Y. Zhou, G. Lin, N. Tran, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

T. Shi, Zirong Tang, F. Shi, 2013 .

N. Tran, F. Shi, B. Yan, 2011, IEEE Photonics Technology Letters.

F. Shi, M. Todd, Michael G. Todd, 2005, IEEE Transactions on Dielectrics and Electrical Insulation.

N. Tran, F. Shi, F.G. Shi, 2008, Journal of Lightwave Technology.

N. Tran, F. Shi, J. You, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

F. Shi, B. Yan, J. You, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

F. Shi, S. Mondal, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

H. K. Kim, F. Shi, S. Chungpaiboonpatana, 2000 .

Gunwoo Kim, F. Shi, J. You, 2017 .

H. K. Kim, K. Okuyama, F. Shi, 2000, Conference Record of the 2000 IEEE International Symposium on Electrical Insulation (Cat. No.00CH37075).

H. K. Kim, K. Okuyama, F. Shi, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

F. Shi, M. Todd, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

H. K. Kim, F. Shi, H. Kim, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

David Hsu, Frank G. Shi, H. K. Kim, 1999, Advanced Lithography.

F. Shi, B. Zhao, H. Zhou, 2004, Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004..

F. Shi, Yu-Chou Shih, Linjuan Huang, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

M. Abdullah, K. Okuyama, F. Shi, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

K. Okuyama, Q. Jiang, F. Shi, 1998 .

F. Shi, Yu-Chou Shih, 2017, IEEE Journal of Selected Topics in Quantum Electronics.

T. King, F. Shi, H. Tong, 1996 .

F. Shi, S. Chungpaiboonpatana, G.P. Lip, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

N. Tran, F. Shi, B. Yan, 2013, 2013 IEEE International Symposium on Advanced Packaging Materials.

Gunwoo Kim, F. Shi, Yu-Chou Shih, 2017, IEEE Journal of Selected Topics in Quantum Electronics.

M. Abdullah, K. Okuyama, F. Shi, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Yuan-Chang Lin, N. Tran, F. Shi, 2010, IEEE Transactions on Components and Packaging Technologies.

Yun Shuai, N. Tran, F. Shi, 2011, IEEE Photonics Technology Letters.

N. Tran, F. Shi, J. You, 2009, Journal of Lightwave Technology.

Yan Zhou, F. Shi, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

F. Shi, Wenning N. Liu, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

F. Shi, J. You, Yu-Chou Shih, 2013, Journal of Electronic Materials.

F. Shi, Yu-Chou Shih, Jielin Guo, 2021, Nanomaterials.

F. Shi, H. T. Vo, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

H. K. Kim, H. Nalwa, Bin Zhao, 2001 .

F. Shi, Yu-Chou Shih, Y. Shao, 2016, Journal of Electronic Materials.

F. Shi, Yu-Chou Shih, Yeong-Her Lin, 2014 .

F. Shi, Yu-Chou Shih, Yeong-Her Lin, 2013, 2013 IEEE International Symposium on Advanced Packaging Materials.

Yaomin Lin, Wenning Liu, F. Shi, 2006, IEEE Transactions on Advanced Packaging.

F. Shi, Wenning N. Liu, Yaomin Lin, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

S. Mondal, Zirong Tang, F. Shi, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Yifan Guo, Yaomin Lin, F.G. Shi, 2005, IEEE Transactions on Advanced Packaging.

S. Chungpaiboonpatana, F.G. Shi, F. Shi, 2004, IEEE Transactions on Advanced Packaging.

Yuan-Chang Lin, N. Tran, Yan Zhou, 2009 .

Gunwoo Kim, F. Shi, J. You, 2016, IEEE Photonics Technology Letters.

Gunwoo Kim, F. Shi, J. You, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Frank G. Shi, Wei Cai, F. Shi, 2016 .

Yongzhi He, Yuan-Chang Lin, N. Tran, 2008, IEEE Transactions on Advanced Packaging.

F. Shi, Chin C. Lee, C. Kao, 2020, Journal of Materials Science: Materials in Electronics.

Frank G. Shi, H. K. Kim, S. Chungpaiboonpatana, 2000, SPIE Advanced Lithography.

Yongzhi He, N. Tran, Yongzhi He, 2010, IEEE Transactions on Components and Packaging Technologies.

F. G. Shi, H. K. Kim, F. Shi, 2000, Conference Record of the 2000 IEEE International Symposium on Electrical Insulation (Cat. No.00CH37075).

Frank G. Shi, Wei Cai, F. Shi, 2017, VLSIC 2017.

F. Shi, S. Chungpaiboonpatana, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

F. Shi, Yu-Chou Shih, Linjuan Huang, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

F.G. Shi, Rong Zhang, F. Shi, 2004, IEEE Transactions on Advanced Packaging.

J. Seinfeld, F. Shi, 1993 .