B. Chatterjee
发表
J. Kwak,
S. Oh,
J. S. Lundh,
2019,
Journal of Electronic Packaging.
H. Kim,
J. S. Lundh,
B. Chatterjee,
2017,
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
T. Beechem,
Hyungtak Kim,
Sukwon Choi,
2020,
Journal of Applied Physics.
R. Dupuis,
J. S. Lundh,
Sukwon Choi,
2018
.
R. Dupuis,
J. S. Lundh,
G. Pavlidis,
2017,
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
C. Nordquist,
U. Singisetti,
Sukwon Choi,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
T. Beechem,
V. Gopalan,
A. Allerman,
2020,
IEEE Electron Device Letters.
T. Beechem,
V. Gopalan,
A. Allerman,
2019,
Applied Physics Letters.
Tae Kyoung Kim,
J. Kwak,
Jaehee Cho,
2020
.
A. Allerman,
A. Baca,
Hyungtak Kim,
2020,
Journal of Electronic Packaging.
H. Kim,
J. S. Lundh,
B. Chatterjee,
2017,
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
S. Dhar,
D. Snyder,
Sukwon Choi,
2018,
The Review of scientific instruments.
A. Rattner,
R. Pearson,
Sukwon Choi,
2020
.
Tae Kyoung Kim,
J. Kwak,
D. Shoemaker,
2019,
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
S. M. Lee,
Jungwoo Oh,
J. Yum,
2019,
Applied Physics Letters.
C. McGray,
Yiwen Song,
Sukwon Choi,
2020,
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Tae Kyoung Kim,
J. Kwak,
S. Oh,
2018
.
C. McGray,
S. Rajan,
S. Krishnamoorthy,
2020,
Applied Physics Letters.
Zeyu Liu,
T. Luo,
R. Shrestha,
2018,
Nature Communications.
Kyle J. Liddy,
G. Jessen,
K. Chabak,
2022,
IEEE Transactions on Electron Devices.
H. Xing,
Sukwon Choi,
B. Chatterjee,
2021,
Applied Physics Letters.
Kyle J. Liddy,
K. Chabak,
Sukwon Choi,
2022,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
D. Ji,
Sukwon Choi,
B. Chatterjee,
2021,
IEEE Electron Device Letters.
G. Jessen,
D. Shoemaker,
K. Chabak,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Hyungtak Kim,
D. Shoemaker,
I. Jovanovic,
2020
.
A. Allerman,
A. Baca,
Hyungtak Kim,
2019,
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
C. Nordquist,
Yiwen Song,
Sukwon Choi,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.