K. Bagnall
发表
Experimental Characterization of the Thermal Time Constants of GaN HEMTs Via Micro-Raman Thermometry
Evelyn N. Wang,
Tomás Palacios,
Omair I. Saadat,
2017,
IEEE Transactions on Electron Devices.
Bernard A. Malouin,
E. Wang,
K. Bagnall,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
E. Wang,
T. Salamon,
D. Antao,
2018,
Microsystems & Nanoengineering.
E. Wang,
K. Bagnall,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
K. Bagnall,
2013
.
E. Wang,
K. Bagnall,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
D. Englund,
E. Wang,
K. Bagnall,
2016,
2016 Conference on Lasers and Electro-Optics (CLEO).
E. Wang,
Y. Muzychka,
K. Bagnall,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
I. Grigorieva,
K. Bagnall,
G. Balakrishnan,
1995
.
E. Wang,
T. Salamon,
D. Antao,
2020,
ACS applied materials & interfaces.
D. Englund,
E. Wang,
M. Walsh,
2019,
ACS applied materials & interfaces.
C. M. Ward-Close,
P. Goodwin,
K. Bagnall,
2000
.
C. M. Ward-Close,
P. Goodwin,
K. Bagnall,
1996
.
P. Midgley,
K. Sasaki,
K. Bagnall,
1992
.
P. Hesketh,
S. Nair,
K. Bagnall,
2012
.
Evelyn N Wang,
E. Wang,
S. Badescu,
2017,
The Review of scientific instruments.
E. Wang,
K. Bagnall,
2016,
The Review of scientific instruments.
S. Narayanan,
E. Wang,
T. Salamon,
2017,
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Banafsheh Barabadi,
Evelyn N. Wang,
Shankar Narayanan,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Evelyn N. Wang,
Rong Xiao,
Ryan Enright,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
B. Bhatia,
E. Wang,
K. Bagnall,
2019,
Nano letters.
Analytical Solution for Temperature Rise in Complex Multilayer Structures With Discrete Heat Sources
Evelyn N. Wang,
Yuri S. Muzychka,
Kevin R. Bagnall,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
E. Wang,
Yangying Zhu,
K. Bagnall,
2018,
Applied Physics Letters.
D. Vanderbilt,
E. Wang,
K. Bagnall,
2016
.
C. S. Tan,
E. Wang,
K. Bagnall,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
P. Midgley,
I. Grigorieva,
K. Sasaki,
1992
.
Evelyn N. Wang,
Yuri S. Muzychka,
Kevin R. Bagnall,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.