J. Beijer

Solution strategies for FEM analysis with nonlinear viscoelastic polymers

J. L. Spoormaker, J. Beijer, J. Spoormaker, 2002 .

Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects

J. Beijer, L. Ernst, J. den Toonder, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Delft University of Technology Color maintenance prediction for LED-based products

J. Bikker, W. Driel, J. Beijer, 2018 .

Some data on the structure of the chloroplast, obtatained by electron microscopy

J. Beijer, L. Algera, W. Iterson, 1947 .

The effect of material properties and initial defects on the thermo-mechanical behavior of a dual damascene module

J. Beijer, G.Q. Zhang, L. Ernst, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Influence of visco-elasticity of low-k dielectrics on thermo-mechanical behavior of dual damascene process

J. Beijer, G.Q. Zhang, L. Ernst, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

Modelling of creep behaviour in injection-moulded HDPE

J. Beijer, J. Spoormaker, 2000 .

Fatigue life of solder bumps in a system in package: relating power cycling to thermal cycling

M.Y. Jansen, J. Beijer, J.A. Bielen, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Developmental stages of flower formation in tulips, narcissi, irises, hyacinths and lilies

J. Beijer, W. Munk, M. C. Cremer, 1974 .

Bud necrosis, a storage disease of tulips. I. Symptoms and the influence of storage conditions

J. Beijer, W. Munk, 1971, Netherlands Journal of Plant Pathology.

EXPERIMENTS ON THE RETARDATION OF DUTCH IRISES

J. Beijer, 1952 .

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

K.M.B. Jansen, D.G. Yang, J.H.J. Janssen, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Warpage minimization of the HVQFN map mould

W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Prediction of thermo-mechanical integrity of wafer backend processes

Willem D. van Driel, G. Q. Zhang, Jaap M. J. den Toonder, 2004, Microelectron. Reliab..

Finite thickness influence on spherical and conical indentation on viscoelastic thin polymer film

J. Beijer, Guoqi Zhang, L. Ernst, 2005 .