O. van der Sluis
发表
M. Geers,
S. Shafqat,
J. Hoefnagels,
2018,
Thin Solid Films.
O. van der Sluis,
W. V. van Driel,
M. van Gils,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
O. van der Sluis,
W. V. van Driel,
G.Q. Zhang,
2008,
2008 58th Electronic Components and Technology Conference.
V. Fiori,
S. Gallois-Garreignot,
S. Orain,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
M. Cherkaoui,
O. van der Sluis,
W. V. van Driel,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
M. Geers,
J. Hoefnagels,
O. van der Sluis,
2012
.
J. Vanfleteren,
M. Geers,
J. Hoefnagels,
2018,
Materials.
O. van der Sluis,
P. Timmermans,
J. Bouquet,
2011
.
O. van der Sluis,
D.G. Yang,
G.Q. Zhang,
2007,
2007 8th International Conference on Electronic Packaging Technology.
O. van der Sluis,
W. V. van Driel,
D.G. Yang,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
O. van der Sluis,
W. V. van Driel,
D.G. Yang,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
J. Vanfleteren,
B. Vandevelde,
Mario Gonzalez,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
O. van der Sluis,
W. V. van Driel,
M. van Gils,
2006,
56th Electronic Components and Technology Conference 2006.
O. van der Sluis,
W. V. van Driel,
G. Zhang,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
O. van der Sluis,
G.Q. Zhang,
J. Janssen,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
O. van der Sluis,
S. Noijen,
S. Walczyk,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
W.D. van Driel,
G.Q. Zhang,
R.A.B. Engelen,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
W.D. van Driel,
G.Q. Zhang,
R.A.B. Engelen,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
O. van der Sluis,
G.Q. Zhang,
P. Timmermans,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Mario Gonzalez,
Yung-Yu Hsu,
Jpm Johan Hoefnagels,
2011
.
Ap Andre Ruybalid,
M. Geers,
J. Hoefnagels,
2019,
International Journal of Solids and Structures.
Zeike A. Taylor,
Christopher Noble,
Olaf van der Sluis,
2017,
Journal of the mechanical behavior of biomedical materials.
O. van der Sluis,
J. Remmers,
S. Noijen,
2013
.
W.D. van Driel,
R.A.B. Engelen,
R.B.R. van Silfhout,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
O. van der Sluis,
W. V. van Driel,
K. Jansen,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Olaf van der Sluis,
Alexandru Opran,
O. van der Sluis,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Scott A. Smith,
O. van der Sluis,
R. Ubachs,
2023,
Journal of the mechanical behavior of biomedical materials.
J. Hoefnagels,
O. van der Sluis,
P. Timmermans,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
O. van der Sluis,
W. V. van Driel,
G. Zhang,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
V. Fiori,
W.D. van Driel,
R.A.B. Engelen,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.