Dandan Wen

发表

Liwei Lin, F. Bai, Huaiwu Zhang, 2017, 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

Dandan Wen, Y. Jing, Yingli Liu, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Dandan Wen, Jingbo Zhang, Yu Liu, 2022, International journal of molecular sciences.

Huaiwu Zhang, Jie Li, Yan Yang, 2019, Materials Research Bulletin.

J. Ran, Dandan Wen, Long Chen, 2023, Journal of Superconductivity and Novel Magnetism.

Mingjing Qi, Liwei Lin, Qing‐An Huang, 2017, 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS).

Jian Huang, Linjun Wang, Feng Gu, 2022, Semiconductor Science and Technology.