Yufeng Jin
发表
R. Sun,
Ching-ping Wong,
Guoping Zhang,
2017,
ACS applied materials & interfaces.
Weiqi Wang,
Yufeng Jin,
Rongfeng Luo,
2018,
IEEE Transactions on Semiconductor Manufacturing.
F. Su,
Jing Chen,
Yufeng Jin,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
W. Wang,
Zhihong Li,
Haixia Zhang,
2009
.
Zhihong Li,
Yufeng Jin,
Xia Lou,
2006,
2006 7th International Conference on Electronic Packaging Technology.
J. Chen,
Weiqi Wang,
M. Miao,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Y. Li,
Xiaomei Yu,
Yufeng Jin,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Yufeng Jin,
Qinghua Zeng,
Jing Chen,
2017,
IEEE Transactions on Device and Materials Reliability.
Yufeng Jin,
Guangyi Shi,
Yuexian Zou,
2009,
2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
Yufeng Jin,
Zhiyuan Zhu,
Min Miao,
2013,
2013 14th International Conference on Electronic Packaging Technology.
M. Miao,
Wengao Lu,
Yufeng Jin,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
M. Miao,
R. Fang,
Yufeng Jin,
2012,
2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology.
M. Miao,
R. Fang,
Wengao Lu,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Zhenyu Wang,
Wei Yan,
Yufeng Jin,
2015,
2015 IEEE International Conference on Cyber Technology in Automation, Control, and Intelligent Systems (CYBER).
Chen Wang,
Haixia Zhang,
Xin Zhao,
2011,
2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
F. Zhu,
Yufeng Jin,
Haixia Zhang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Yufeng Jin,
Min Miao,
Runiu Fang,
2012,
2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).
Huan Liu,
Yufeng Jin,
Yang Yang,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
M. Miao,
Yufeng Jin,
Huan Liu,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Weiqi Wang,
Yufeng Jin,
Rongfeng Luo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yufeng Jin,
Qinghua Zeng,
Jing Chen,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Yufeng Jin,
Jun Wei,
Peck Cheng Lim,
2003,
Int. J. Comput. Eng. Sci..
Yufeng Jin,
Jun Wei,
P. C. Lim,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
Zhenyu Wang,
Yufeng Jin,
Guangyi Shi,
2016,
2016 IEEE International Conference on Cyber Technology in Automation, Control, and Intelligent Systems (CYBER).
M. Miao,
Yufeng Jin,
Shengli Ma,
2009,
2009 11th Electronics Packaging Technology Conference.
M. Miao,
Yufeng Jin,
Shengli Ma,
2012,
2012 4th Electronic System-Integration Technology Conference.
M. Miao,
J. Chen,
Yufeng Jin,
2012
.
M. Miao,
Yufeng Jin,
Wenping Kang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Yufeng Jin,
Min Miao,
Wenping Kang,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
M. Miao,
Yufeng Jin,
Xin Sun,
2008,
2008 9th International Conference on Solid-State and Integrated-Circuit Technology.
M. Miao,
Yufeng Jin,
Wenping Kang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
M. Miao,
J. Chen,
Yufeng Jin,
2012
.
Yufeng Jin,
Min Miao,
Xin Sun,
2016
.
J. Chen,
M. Miao,
Yufeng Jin,
2014
.
Shi Sun,
Yufeng Jin,
Guifu Ding,
2016
.
M. Miao,
R. Fang,
Yufeng Jin,
2016,
2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP).
Yufeng Jin,
Min Miao,
Xin Sun,
2015,
IEEE Transactions on Electron Devices.
Yufeng Jin,
Guoping Zhang,
Ching-Ping Wong,
2017,
Small.
Yufeng Jin,
Zhou Zhang,
Yuliang Deng,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
L. Xia,
Wengang Wu,
Jinyan Wang,
2020,
physica status solidi (a).
Yudan Pi,
Wei Wang,
Yufeng Jin,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Zhihong Li,
Jing Chen,
Kun Liu,
2014
.
J. Chen,
Yufeng Jin,
Rongfeng Luo,
2016
.
M. Miao,
Yufeng Jin,
Liwei Zhao,
2008,
2008 9th International Conference on Solid-State and Integrated-Circuit Technology.
J. Chen,
Yufeng Jin,
Qinghua Zeng,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Yufeng Jin,
W. Lu,
Gary Chaw,
2019,
2019 IEEE International Conference on Computation, Communication and Engineering (ICCCE).
Wei Meng,
Yufeng Jin,
J. Chen,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Yufeng Jin,
Min Miao,
Xin Sun,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Xinnan Lin,
Maojun Wang,
Yufeng Jin,
2021,
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Zhuojie Chen,
Wengang Wu,
Yufeng Jin,
2017,
2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
J. Chen,
Weiqi Wang,
Yufeng Jin,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
C. Wong,
Yufeng Jin,
Jun Wei,
2004
.
Jing Chen,
M. Miao,
Yudan Pi,
2018,
International Journal of Heat and Mass Transfer.
Wei Wang,
Yufeng Jin,
Jinling Yu,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Yufeng Jin,
Yang Yang,
Meihua Liu,
2021,
Micromachines.
C. Wen,
Maojun Wang,
B. Xie,
2018,
IEEE Transactions on Electron Devices.
Yufeng Jin,
Jinwen Zhang,
Chen-Chun Lin,
2017
.
Yufeng Jin,
Zhiyuan Zhu,
Min Yu,
2017
.
L. Xia,
Wengang Wu,
Yufeng Jin,
2021,
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Yufeng Jin,
Meihua Liu,
2021,
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Yufeng Jin,
Yufeng Jin,
Jing Chen,
2016
.
Yufeng Jin,
Shengli Ma,
J. Chen,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Wei Wang,
Yufeng Jin,
Qi Wang,
2022,
SSRN Electronic Journal.
Xiaole Cui,
Yufeng Jin,
Min Miao,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Duwei Hu,
M. Miao,
R. Fang,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Yufeng Jin,
Z. Wang,
Haochun Tang,
2007
.
Yufeng Jin,
Zhiyuan Zhu,
M. Yu,
2016
.
Wei Meng,
Yufeng Jin,
Shengli Ma,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Yufeng Jin,
Hao Luo,
Tao Gao,
2006,
2006 7th International Conference on Electronic Packaging Technology.
Kuan‐Chang Chang,
Xinnan Lin,
Yufeng Jin,
2020
.
Maojun Wang,
Yufeng Jin,
Jianguo Chen,
2022,
IEEE Transactions on Electron Devices.
Yufeng Jin,
Xinyang Zhao,
M. Yu,
2016,
2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT).
M. Miao,
Y. Hao,
Yufeng Jin,
2006,
2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings.
Yufeng Jin,
Zhiyuan Zhu,
Lisha Liu,
2015
.
Zhihong Li,
Junshi Li,
D. Huang,
2021,
2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS).
M. Miao,
R. Fang,
Yufeng Jin,
2019,
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
H. Gan,
M. Miao,
Yufeng Jin,
2010,
2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology.
R. Sun,
Guoping Zhang,
Fei Han,
2020
.
Yufeng Jin,
Min Miao,
Xin Sun,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
J. Chen,
Yufeng Jin,
Yiming Zhang,
2012
.
Wei Wang,
Yufeng Jin,
Liulin Hu,
2021,
Micromachines.
Wei Wang,
Yufeng Jin,
Shengli Ma,
2023,
Microelectronics Reliability.
M. Miao,
R. Fang,
Yufeng Jin,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
H. Gan,
M. Miao,
Jing Zhang,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Huan Liu,
Yufeng Jin,
Xin Sun,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Zhihong Li,
Min Miao,
Yufeng Jin,
2001,
Other Conferences.
Yong Zhao,
Yufeng Jin,
Chang Yu-Cheng,
2020,
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Nanxin Wang,
Lijun Sun,
Yufeng Jin,
2022,
Micromachines.
Yufeng Jin,
Zhiyuan Zhu,
M. Yu,
2021,
Microelectronic Engineering.
Wei Meng,
Yufeng Jin,
Shengli Ma,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Xin Sun,
Yufeng Jin,
Liyuan Wang,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Wei Wang,
Zhihong Li,
Yufeng Jin,
2018,
Science China Information Sciences.
Yufeng Jin,
Guangyi Shi,
Yuexian Zou,
2009,
IEEE Sensors Journal.
Lifeng Qin,
Yufeng Jin,
Shengli Ma,
2022,
Micromachines.
Yufeng Jin,
Shengli Ma,
Hungping Lee,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Yang Yang,
Heng Li,
Yufeng Jin,
2019,
2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).
Yilong Hao,
Yufeng Jin,
Cheng P. Wen,
2018,
IEEE Electron Device Letters.
C. Wen,
Wengang Wu,
Maojun Wang,
2017,
IEEE Electron Device Letters.
Yufeng Jin,
Huan Liu,
Min Miao,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yufeng Jin,
Zhiyuan Zhu,
Zhao Zhang,
2016,
2016 China Semiconductor Technology International Conference (CSTIC).
Yufeng Jin,
Shengli Ma,
Yang Yang,
2021,
Zhongguó gongchéng xuékan.
Yufeng Jin,
Shengli Ma,
Chen Wang,
2021,
Micromachines.
Yufeng Jin,
Yanming Xia,
Shengli Ma,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Jinyan Wang,
Yufeng Jin,
D. Tian,
2012
.
Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers
Wei Wang,
Yufeng Jin,
Liulin Hu,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Yufeng Jin,
Min Miao,
Xin Sun,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Ru Huang,
Xing Zhang,
Jinyan Wang,
2010,
IEEE Transactions on Plasma Science.
W. Wang,
Han Xu,
Yufeng Jin,
2022,
Journal of Micromechanics and Microengineering.
Duwei Hu,
M. Miao,
R. Fang,
2012
.
M. Miao,
Yufeng Jin,
Cao Rui,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Xin Sun,
Yufeng Jin,
Min Miao,
2011,
2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
Jing Zhang,
Yufeng Jin,
Min Miao,
2010,
2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems.
Yufeng Jin,
Zhong-he Jin,
Rongfeng Luo,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
W. Wang,
Han Xu,
Yufeng Jin,
2023,
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS).
M. Miao,
Yufeng Jin,
Shengli Ma,
2022,
Electronics Letters.
J. Chen,
Yufeng Jin,
Liulin Hu,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Jing Chen,
M. Miao,
Yudan Pi,
2018
.
Yufeng Jin,
Tianzhun Wu,
Rongfeng Luo,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Yufeng Jin,
Qinghua Zeng,
Jing Chen,
2018,
IEEE Transactions on Semiconductor Manufacturing.
Wei Meng,
Yufeng Jin,
Shengli Ma,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Yudan Pi,
Wei Wang,
Yufeng Jin,
2013,
2013 14th International Conference on Electronic Packaging Technology.
M. Miao,
Yufeng Jin,
Wenping Kang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
M. Miao,
J. Chen,
Yufeng Jin,
2012
.
J. Chen,
Yufeng Jin,
Zhiyuan Zhu,
2012
.
M. Miao,
Yufeng Jin,
Wenping Kang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Jiye Zhang,
Yufeng Jin,
Guangyi Shi,
2015,
2015 IEEE International Conference on Cyber Technology in Automation, Control, and Intelligent Systems (CYBER).
J. Chen,
Wei Meng,
Yufeng Jin,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Yufeng Jin,
Shengli Ma,
Shuwei He,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Yufeng Jin,
J. Chen,
Qinghua Zeng,
2017,
IEEE Transactions on Device and Materials Reliability.
Wei Wang,
Yufeng Jin,
Xianglong Chu,
2023,
Micromachines.
Han Xu,
Pantian Zhang,
Wei Wang,
2022,
Flexible and Printed Electronics.
Yufeng Jin,
Wei Wang,
Jing Chen,
2019,
Journal of Micromechanics and Microengineering.
L. Xia,
Wengang Wu,
Yufeng Jin,
2022,
2022 IEEE 5th International Conference on Electronics Technology (ICET).
Wei Wang,
Yufeng Jin,
J. Cao,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Z. Wen,
Zhiyu Chen,
Y. Hao,
2009
.
J. Chen,
Yufeng Jin,
Qinghua Zeng,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Ying Zhao,
Min Miao,
Yufeng Jin,
2006,
International Commission for Optics.
Xue Chuan Shan,
Ying Zhao,
Min Miao,
2006,
International Commission for Optics.
Guangyi Shi,
Yuexian Zou,
Yu Feng Jin,
2009
.
Yufeng Jin,
Yanming Xia,
Shengli Ma,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
W. Wang,
Yufeng Jin,
Rongfeng Luo,
2018,
2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).
Wei Wang,
Yufeng Jin,
Wenhua Xu,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
F. Su,
Yufeng Jin,
J. Chen,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Xiaole Cui,
Yufeng Jin,
Yucheng Chang,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Yilong Hao,
Yandong He,
Yufeng Jin,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
F. Su,
Yufeng Jin,
Shengli Ma,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
W. Wang,
Han Xu,
Yufeng Jin,
2023,
Journal of Microelectromechanical Systems.