Hong Lin

Electrowetting of the blood droplet on the hydrophobic film of the EWOD chips

Lei Li, Hong Lin, Huan Hu, 2005, 2005 IEEE Engineering in Medicine and Biology 27th Annual Conference.

Cleaning of high aspect ratio submicron trenches

A. Busnaina, Hong Lin, I. Suni, 2002, 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259).

Process Characterization and Control of Polycrystalline SiGe as the Gate Electrode in CMOS Fabrication

Hong Lin, Shi-Wei Gu, V. Hornback, 2005 .

Damage-Free Cryogenic Aerosol Clean Processes

Hong Lin, J. Lauerhaas, K. Chioujones, 2006, IEEE Transactions on Semiconductor Manufacturing.

Damage-Free Cryogenic Aerosol Clean Processes

Chienfan Yu, Hong Lin, J. Lauerhaas, 2007, The 17th Annual SEMI/IEEE ASMC 2006 Conference.

Deposition and Characterization of Polycrystalline Si1 − x Ge x Films for CMOS Transistors Gate Electrode Applications

Joyce C. Lin, V. Gopinath, E. Li, 2005 .

Nanoporous Materials Integration Into Advanced Microprocessors

E. T. Ryan, A. Simon, S. Nitta, 2005 .

Particle adhesion and removal mechanisms in post-CMP cleaning processes

Hong Lin, Ahmed Busnaina, A. Busnaina, 2002, ASMC 2002.

Urethane-Functionalized Graphene Oxide for Improving Compatibility and Thermal Conductivity of Waterborne Polyurethane Composites

Zetian Zhang, Zhengjun Li, Hong Lin, 2018 .

Physical removal of nano-scale defects from surfaces

Hong Lin, Ahmed Busnaina, A. Busnaina, 2002, 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259).