S. Sosin

RF-MEMS wafer-level packaging using through-wafer via technology

J. Iannacci, R. Gaddi, M. Bartek, 2006, 2006 8th Electronics Packaging Technology Conference.

RF–MEMS wafer-level packaging using through-wafer interconnect

R. Gaddi, Jacopo Iannacci, M. Bartek, 2008 .

Measurement and investigation of thermal properties of the on-chip metallization for integrated power technologies

Dan Simon, C. Boianceanu, S. Sosin, 2013, 2013 IEEE International Conference on Microelectronic Test Structures (ICMTS).

Process Technology of High-Aspect-Ratio Silicon Beams for Stretchable Silicon Electronics

R. Dekker, J. Tian, S. Sosin, 2008, 2008 10th Electronics Packaging Technology Conference.

Strength of Elastomeric Adhesive Films in the Triaxial Stress State

G. Vinogradov, S. Sosin, A. Elkin, 1980 .

Fracture of uncured linear flexible-chain polymers of narrow molecular mass distribution in triaxial stress (behaviour of elastomers as adhesives)

G. Vinogradov, S. Sosin, A. Elkin, 1978 .

Chemoresistive gas sensor manufacturing using mixed technologies

O. Nedelcu, H.-J. Ritzhaupt-Kleissl, C. Moldovan, 2005, CAS 2005 Proceedings. 2005 International Semiconductor Conference, 2005..

Mixed technologies for gas sensors microfabrication

S. Dimov, R. Dorey, O. Nedelcu, 2005 .