T. Ju

Transient response of a laminated composite plate: Results from homogenization and discretization

A. H. Shah, Arvind H. Shah, S. Datta, 1992 .

Effects of Ceramic Ball-Grid-Array Package's Manufacturing Variations on Solder Joint Reliability

Yung-Cheng Lee, T. Ju, T. H. Ju, 1994, Proceedings of the International Conference on Multichip Modules.

Packaging of a 128 by 128 liquid-crystal-on-silicon spatial light modulator using self-pulling soldering

K.M. Johnson, Y.C. Lee, K. M. Johnson, 1995, IEEE Photonics Technology Letters.

Scattering of an Impact Wave by a Crack in a Composite Plate

A. H. Shah, Subhendu K. Datta, S. Datta, 1992 .

Transient scattering of Rayleigh-Lamb waves by a surface-breaking crack: Comparison of numerical simulation and experiment

S. W. Liu, S. K. Datta, S. W. Liu, 1991 .

Pulse propagation in a laminated composite plate and nondestructive evaluation

S. Datta, T. Ju, 1992 .

Transient response of a laminated composite plate

A. H. Shah, S. Datta, R. Bratton, 1992 .