B. Schwierzi

Thickness Measurement of Passivated Metallization Layers by Saw Dispersion

J. Krause, B. Schwierzi, 1992 .

Influence of processing parameters on selectivity in a CVD-process of copper using Cu/sup +1/(hfac)(TMVS)

B. Schwierzi, U. Hohne, A. Abdul-Hak, 1997, European Workshop Materials for Advanced Metallization,.

Sensitive high‐Tc transition edge bolometer on a micromachined silicon membrane

B. Schwierzi, T. Heidenblut, H. Neff, 1995 .

A high-T/sub c/ superconductor bolometer on a silicon nitride membrane

Martin J. de Nivelle, M. Elwenspoek, P. D. de Korte, 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.

LOW NOISE HIGH-TC SUPERCONDUCTING BOLOMETERS ON SILICON NITRIDE MEMBRANES FOR FAR-INFRARED DETECTION

P.A.J. de Korte, M. P. Bruijn, Michael Curt Elwenspoek, 1997 .

A high-Tc superconductor bolometer for remote sensing of atmospheric OH

P. Korte, M. Elwenspoek, B. Schwierzi, 1996 .

HTS Bolometers for FIR Applications

P. Korte, M. Elwenspoek, B. Schwierzi, 1997 .

Excess noise, structural properties, and their effects on bolometric performance of thin superconducting films on silicon membranes

B. Schwierzi, T. Heidenblut, H. Neff, 1995 .

Electrical characterization of TiN/TiSi 2 and WN/TiSi 2 Cu-diffusion barriers using Schottky diodes

B. Schwierzi, R. Ferretti, C. Ahrens, 1997 .