Hongbo Xu

发表

Mingyu Li, Jongmyung Kim, Daewon Kim, 2008, IEEE Transactions on Advanced Packaging.

Mingyu Li, Hongbo Xu, Shuai Zhang, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Mingyu Li, Jongmyung Kim, Hongbo Xu, 2009 .

Mingyu Li, Jongmyung Kim, Hongbo Xu, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Kecheng Zhang, Na Li, Jiupeng Zhao, 2020, Advanced materials.

Chunqing Wang, Mingyu Li, Hongbo Xu, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Tingting Hao, Kecheng Zhang, Jiupeng Zhao, 2022, Sensors and Actuators B: Chemical.

Mingyu Li, Jianqiang Wang, Hongbo Xu, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Y. Li, Yiyong Wu, Xiaoxu Liu, 2017, Journal of Materials Science: Materials in Electronics.

Na Li, Jiupeng Zhao, Yao Li, 2021, ACS Applied Nano Materials.

Tingting Hao, S. Magdassi, Jiupeng Zhao, 2022, ACS applied materials & interfaces.

Mingyu Li, Hongbo Xu, Hongtao Chen, 2009 .

Jiupeng Zhao, Yao Li, Hongbo Xu, 2019, Journal of Bionic Engineering.

Mingyu Li, Hongbo Xu, Hongyun Zhao, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Mingyu Li, Qinmiao Sun, Hongbo Xu, 2020, Journal of Materials Science: Materials in Electronics.

Hongbo Xu, G. Shi, Miao Xu, 2020, Science China Technological Sciences.

Jussi Hokka, Toni T. Mattila, Hongbo Xu, 2013, Journal of Electronic Materials.

Hongbo Xu, Vesa Vuorinen, Mervi Paulasto-Kröckel, 2015 .

Mingyu Li, Jongmyung Kim, Hongbo Xu, 2009 .

Kecheng Zhang, Lifen Xiao, Jiupeng Zhao, 2021, Colloid and Polymer Science.

Y. Li, J. Qiu, Jiupeng Zhao, 2018, Scientific Reports.

Jiupeng Zhao, Yao Li, Hongbo Xu, 2022, Inorganic Chemistry Frontiers.

Mingyu Li, Hongbo Xu, Mingqi Yang, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Mingyu Li, Jongmyung Kim, Daewon Kim, 2008, 2008 10th Electronics Packaging Technology Conference.

Mingyu Li, Jongmyung Kim, Hongbo Xu, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Jussi Hokka, Hongbo Xu, Mervi Paulasto-Kröckel, 2013, Journal of Electronic Materials.

J. Li, T. Suni, H. Heikkinen, 2013 .