J. Y. Lai

An investigation into the effects of probing and wire bonding stress on the reliability of BOAC

K. M. Chen, B. C. Wu, K. H. Tang, 2006, Microelectron. Reliab..

Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology

J. Y. Lai, Suresh Ramalingam, Steve Chiu, 2015 .

Support Vector Machine Experiments for Road Recognition in High Resolution Images

Arcot Sowmya, John Trinder, J. Y. Lai, 2005, MLDM.