Q. Fan
发表
Dong‐sheng Li,
Hui-wang Cui,
Q. Fan,
2013,
Electronic Materials Letters.
Johan Liu,
L. Ye,
Xiuzhen Lu,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Dong‐sheng Li,
Hui-wang Cui,
Q. Fan,
2013
.
Dong‐sheng Li,
Hui-wang Cui,
Q. Fan,
2014
.
Q. Fan,
K. Tang,
H. Cui,
2007
.
Y. Mao,
Q. Fan,
Yong Wang,
2008
.
Qiong Fan,
Hui-Wang Cui,
Dong‐sheng Li,
2013
.
Dong‐sheng Li,
Hui-wang Cui,
Q. Fan,
2013
.
Dong‐sheng Li,
Hui-wang Cui,
Q. Fan,
2013,
Electronic Materials Letters.
Dong‐sheng Li,
Hui-wang Cui,
Q. Fan,
2013
.
Johan Liu,
L. Ye,
Dong‐sheng Li,
2011
.
Dong‐sheng Li,
Hui-wang Cui,
Q. Fan,
2012
.
Dong‐sheng Li,
Hui-wang Cui,
Q. Fan,
2012,
Journal of Electronic Materials.
J. Liu,
Q. Fan,
Si Chen,
2010,
2010 International Symposium on Advanced Packaging Materials: Microtech (APM).
Johan Liu,
L. Ye,
Dongsheng Li,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Qiong Fan,
Hui-Wang Cui,
Dong‐sheng Li,
2013
.
The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives
Johan Liu,
L. Ye,
Dong‐sheng Li,
2011
.