Katsuyuki Ikeuchi

发表

An 802.11ax 4×4 spectrum-efficient WLAN AP transceiver SoC supporting 1024QAM with frequency-dependent IQ calibration and integrated interference analyzer

Makoto Arai, Hiroyuki Kobayashi, Atsushi Suzuki, 2018, 2018 IEEE International Solid - State Circuits Conference - (ISSCC).

Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing

Takayasu Sakurai, Gil-Su Kim, Satoshi Sasaki, 2010, IEEE Journal of Solid-State Circuits.

Through Silicon Capacitive Coupling (TSCC) interface for 3D stacked dies

Takayasu Sakurai, Makoto Takamiya, Katsuyuki Ikeuchi, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

A 95mV-startup step-up converter with Vth-tuned oscillator by fixed-charge programming and capacitor pass-on scheme

Takayasu Sakurai, Koichi Ishida, Makoto Takamiya, 2011, 2011 IEEE International Solid-State Circuits Conference.

Startup Techniques for 95 mV Step-Up Converter by Capacitor Pass-On Scheme and ${\rm V}_{\rm TH}$-Tuned Oscillator With Fixed Charge Programming

Koichi Ishida, Takayasu Sakurai, Po-Hung Chen, 2012, IEEE Journal of Solid-State Circuits.

Switched Resonant Clocking (SRC) scheme enabling dynamic frequency scaling and low-speed test

Takayasu Sakurai, Koichi Ishida, Makoto Takamiya, 2009, 2009 IEEE Custom Integrated Circuits Conference.

Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing

Takayasu Sakurai, Gil-Su Kim, Satoshi Sasaki, 2011, IEEE J. Solid State Circuits.

Post-Silicon Clock Deskew Employing Hot-Carrier Injection Trimming With On-Chip Skew Monitoring and Auto-Stressing Scheme for Sub/Near Threshold Digital Circuits

Takayasu Sakurai, Yu Pu, Makoto Takamiya, 2011, IEEE Transactions on Circuits and Systems II: Express Briefs.

Reduction of minimum operating voltage (VDDmin) of CMOS logic circuits with post-fabrication automatically selective charge injection

Takayasu Sakurai, Makoto Takamiya, Masahiro Nomura, 2011, IEEE/ACM International Symposium on Low Power Electronics and Design.

1 Gb/s, 50 µm × 50 µm Pads on Board Wireless Connector Based on Track-and-Charge Scheme Allowing Contacted Signaling

Takayasu Sakurai, Gil-Su Kim, Makoto Takamiya, 2011, IEICE Trans. Electron..

A 2.4 GHz CMOS Doherty power amplifier with dynamic biasing scheme

Shoji Otaka, Shigehito Saigusa, Kohei Onizuka, 2012, 2012 IEEE Asian Solid State Circuits Conference (A-SSCC).

A high-speed, low-power capacitive-coupling transceiver for wireless wafer-level testing systems

Takayasu Sakurai, Gil-Su Kim, Makoto Takamiya, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

PAPER Special Section on Analog Circuits and Related SoC Integration Technologies 1Gb/s, 50µm × 50µm Pads on Board Wireless Connector Based on Track-and-Charge Scheme Allowing Contacted Signaling

Takayasu Sakurai, Gil-Su Kim, Makoto Takamiya, 2011 .