B. Tseng
发表
Lin-Kun Wu,
D. Su,
B. Tseng,
1996
.
Nick K. H. Huang,
Bin-Chyi Tseng,
B. Tseng,
2019,
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
Bin-Chyi Tseng,
Li-Chun Liao,
Jia-Yan Ling,
2009,
2009 IEEE International Symposium on Electromagnetic Compatibility.
Lin-Kun Wu,
Bin-Chyi Tseng,
Li-Chun Liao,
2011,
IEEE Transactions on Electromagnetic Compatibility.
Bin-Chyi Tseng,
Li-Chun Liao,
Shin-Jung Gu,
2009,
2009 Fifth International Conference on Intelligent Information Hiding and Multimedia Signal Processing.
Chulsoon Hwang,
Hank Lin,
Bin-Chyi Tseng,
2020,
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Nick K. H. Huang,
Bin-Chyi Tseng,
Jin Ning Hu,
2020,
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE.