B. Tseng

发表

Nick K. H. Huang, Bin-Chyi Tseng, B. Tseng, 2019, 2019 Electrical Design of Advanced Packaging and Systems (EDAPS).

Bin-Chyi Tseng, Li-Chun Liao, Jia-Yan Ling, 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

Lin-Kun Wu, Bin-Chyi Tseng, Li-Chun Liao, 2011, IEEE Transactions on Electromagnetic Compatibility.

Bin-Chyi Tseng, Li-Chun Liao, Shin-Jung Gu, 2009, 2009 Fifth International Conference on Intelligent Information Hiding and Multimedia Signal Processing.

Chulsoon Hwang, Hank Lin, Bin-Chyi Tseng, 2020, 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Nick K. H. Huang, Bin-Chyi Tseng, Jin Ning Hu, 2020, 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE.