S. Gupte

Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling

P. Lall, S. Gupte, P. Choudhary, 2006, IEEE Transactions on Electronics Packaging Manufacturing.

Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics

P. Lall, S. Gupte, P. Choudhary, 2009, IEEE Transactions on Components and Packaging Technologies.

Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies

P. Lall, S. Gupte, P. Choudhary, 2006, 56th Electronic Components and Technology Conference 2006.

Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads

P. Lall, S. Gupte, P. Choudhary, 2007, IEEE Transactions on Components and Packaging Technologies.

Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads

P. Lall, S. Gupte, P. Choudhary, 2009, 2007 Proceedings 57th Electronic Components and Technology Conference.

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

P. Lall, J.C. Suhling, S. Gupte, 2008, IEEE Transactions on Components and Packaging Technologies.

Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics

P. Lall, S. Gupte, P. Choudhary, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies

P. Lall, J.C. Suhling, S. Gupte, 2008, IEEE Transactions on Components and Packaging Technologies.

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

P. Lall, S. Gupte, P. Choudhary, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..