J. Suhling

发表

Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling

P. Lall, S. Gupte, P. Choudhary, 2006, IEEE Transactions on Electronics Packaging Manufacturing.

Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical Loads

P. Lall, J. Suhling, M. Hande, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Latent damage assessment and prognostication of residual life in airborne lead-free electronics under thermo-mechanical loads

P. Lall, J. Suhling, M. Hande, 2008, 2008 International Conference on Prognostics and Health Management.

Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments

P. Lall, N. Singh, M. Strickland, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Modeling and Analysis of a Blade/Receptacle Pair for the Prediction of Vibration-Induced Fretting Degradation

G.T. Flowers, M. Bozack, B.I. Rickett, 2008, 2008 Proceedings of the 54th IEEE Holm Conference on Electrical Contacts.

Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies

P. Lall, S. Gupte, P. Choudhary, 2006, 56th Electronic Components and Technology Conference 2006.

Principal component regression models for life prediction of plastic ball grid arrays on copper-core and no-core assemblies

P. Lall, J. Suhling, A. Shirgaokar, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads

P. Lall, S. Gupte, P. Choudhary, 2009, 2007 Proceedings 57th Electronic Components and Technology Conference.

Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components

P. Lall, J. Suhling, D. Iyengar, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Analysis and Prediction of Vibration-Induced Fretting Motion in a Blade/Receptacle Connector Pair

Fei Xie, G.T. Flowers, M. Bozack, 2007, Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts.

Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact

P. Lall, J. Suhling, Yueli Liu, 2004, IEEE Transactions on Components and Packaging Technologies.

Algorithms for prognostication of prior damage and residual life in lead-free electronics subjected to thermo-mechanical loads

P. Lall, J. Suhling, M. Hande, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics

P. Lall, S. Gupte, P. Choudhary, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Leading indicator based assessment of operational readiness in electronics subjected to multiple environments

P. Lall, J. Suhling, K. Goebel, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

P. Lall, S. Gupte, P. Choudhary, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Thermal reliability considerations for Deployment of area array packages in harsh environments

P. Lall, M. Strickland, J. Blanche, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).