M. Cai

发表

M. Cai, G. Zhang, Fengze Hou, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

M. Cai, Daoguo Yang, Guoqi Zhang, 2017, IEEE Photonics Journal.

F. Zhang, M. Cai, Guo-Qi Zhang, 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

M. Cai, Daoguo Yang, Ping Zhang, 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.

D. Fan, Bingbing Tian, G. Zhu, 2018, ACS applied materials & interfaces.

M. Cai, Daoguo Yang, Lei Wang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Zhi Liang, Daoguo Yang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

M. Cai, Daoguo Yang, Zaifu Cui, 2011, 2011 International Symposium on Advanced Packaging Materials (APM).

Wei He, Miao Cai, Jianna Zheng, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Zhi Liang, Daoguo Yang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Ding Ma, Daoguo Yang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Ding Ma, Daoguo Yang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Daoguo Yang, Xindong Chen, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Xianping Chen, T. Ren, M. Cai, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Daoguo Yang, H. Jia, 2013, 2013 14th International Conference on Electronic Packaging Technology.

M. Cai, D. Yang, H. Jia, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Dongjing Liu, M. Cai, D. Yang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Wenbin Chen, M. Cai, Daoguo Yang, 2016, 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT).

M. Cai, Daoguo Yang, Guoqi Zhang, 2019, The Science of the total environment.

M. Cai, D. Yang, D. Xie, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

M. Cai, Zhi Liang, Daoguo Yang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Daoguo Yang, Jing Xiao, 2018, IEEE Photonics Journal.

Xianping Chen, M. Cai, Daoguo Yang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Xianping Chen, T. Ren, M. Cai, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Daoguo Yang, Guoqi Zhang, 2019, Surface Science.

Dongjing Liu, M. Cai, Daoguo Yang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Song Wu, Miao Cai, Xiang Wan, 2015, 2015 IEEE International Conference on Mechatronics and Automation (ICMA).

Ping Zhang, Miao Cai, Weihai Zhang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

M. Cai, Daoguo Yang, Daoshuang Geng, 2022, 2022 3rd International Conference on Big Data, Artificial Intelligence and Internet of Things Engineering (ICBAIE).