C. Pei

A research on optoelectronic coupler storage reliability by accelerated degradation testing

Guicui Fu, B. Wan, C. Pei, 2016, 2016 Annual Reliability and Maintainability Symposium (RAMS).

Failure analysis of plastic encapsulated circuits after autoclaving

Guicui Fu, B. Wan, C. Pei, 2016 .

Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

K. Suganuma, Guicui Fu, Chuantong Chen, 2017, Journal of Electronic Materials.

STORAGE DEGRADATION MECHANISM ANALYSIS AND STORAGE LIFE PREDICTION OF THE OPTOELECTRONIC COUPLER BASED ON MULTI-CHANNEL DEGRADATION TESTING DATA

B. Wan, C. Pei, Y. Dong, 2014 .

Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste

K. Suganuma, T. Sugahara, Chuantong Chen, 2019, Japanese Journal of Applied Physics.

Thermal shock reliability of GaN die-attached on DBA with Ag sinter paste

K. Suganuma, Chuantong Chen, S. Nagao, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Simplified approach for steady thermal analysis of chips with variable power based on spatial autocorrelation

Guicui Fu, Bo Wan, Chun Pei, 2017 .