Fengman Liu
发表
Liqiang Cao,
L. Wan,
Fengman Liu,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Liqiang Cao,
Fengwei Dai,
Fengman Liu,
2017
.
Liqiang Cao,
Fengman Liu,
H. Xue,
2017
.
Liqiang Cao,
Fengman Liu,
H. Xue,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
L. Wan,
Fengman Liu,
Baoxia Li,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Liqiang Cao,
Jun Li,
Fengman Liu,
2014,
2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.
Liqiang Cao,
Fengwei Dai,
Qidong Wang,
2022,
Journal of Lightwave Technology.
Fengman Liu,
Dejian Li,
Shunfeng Han,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Liqiang Cao,
Fengman Liu,
Huimin He,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Fengman Liu,
Huimin He,
Dejian Li,
2021,
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Liqiang Cao,
Qidong Wang,
Fengman Liu,
2022,
Micromachines.
Ciyuan Qiu,
Dan Li,
Li Geng,
2023,
Frontiers of Optoelectronics.
Liqiang Cao,
Jiajie Fan,
Hengyun Zhang,
2020,
IEEE Transactions on Power Electronics.
Zhenhua Wu,
Fengman Liu,
Jiangtao Liu,
2023,
Carbon.
Fengman Liu,
Lei Deng,
Deming Liu,
2018,
Optics express.
Liqiang Cao,
Fengman Liu,
H. Xue,
2023,
Optics & Laser Technology.
Fengman Liu,
Liqiang Cao,
Jun Li,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Zhao Zhang,
Liyuan Liu,
N. Wu,
2022,
IEEE Transactions on Circuits and Systems I: Regular Papers.
Fengman Liu,
Qian She,
Liqiang Cao,
2017,
Microelectron. Reliab..
Liqiang Cao,
Fengwei Dai,
Qidong Wang,
2022,
Processes.
Fengman Liu,
Peng Wu,
Baoxia Li,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Liqiang Cao,
X. Jing,
Daquan Yu,
2016,
Journal of Materials Science: Materials in Electronics.
Fengman Liu,
H. Xue,
Huimin He,
2024,
Photonics.
Fengman Liu,
H. Xue,
P. Yang,
2023,
2023 24th International Conference on Electronic Packaging Technology (ICEPT).