Fengze Hou
发表
Liqiang Cao,
L. Wan,
Fengman Liu,
2013,
2013 14th International Conference on Electronic Packaging Technology.
M. Cai,
G. Zhang,
Fengze Hou,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Liqiang Cao,
J. Ferreira,
G. Zhang,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Liqiang Cao,
Jun Li,
Fengze Hou,
2020,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
Fengze Hou,
Wenbo Wang,
Jianing Wang,
2021,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
Liqiang Cao,
J. Ferreira,
Qidong Wang,
2020,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
Liqiang Cao,
Fengman Liu,
H. Xue,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Liqiang Cao,
L. Wan,
Hongwen He,
2013,
2013 IEEE International Symposium on Advanced Packaging Materials.
Liqiang Cao,
L. Wan,
Jun Li,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Liqiang Cao,
Feng Chen,
Peng Sun,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Lei Liu,
Fengze Hou,
G.Q. Zhang,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages
Weiqi Wang,
Liqiang Cao,
J. Ferreira,
2019,
Applied Thermal Engineering.
Liqiang Cao,
J. Ferreira,
Qidong Wang,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Liqiang Cao,
Qidong Wang,
Jun Li,
2022,
Applied Thermal Engineering.
Lei Liu,
Fengze Hou,
Yang Hai,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Liqiang Cao,
Jiajie Fan,
Hengyun Zhang,
2020,
IEEE Transactions on Power Electronics.
Fengze Hou,
Binbin Jiao,
Ruiwen Liu,
2022,
Micromachines.
Fengman Liu,
Liqiang Cao,
Jun Li,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Jiajie Fan,
Xuejun Fan,
Fengze Hou,
2021,
IEEE Transactions on Electron Devices.
Liqiang Cao,
Jun Li,
Fengze Hou,
2021
.
Fengze Hou,
G.Q. Zhang,
Daoguo Yang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Fengman Liu,
Qian She,
Liqiang Cao,
2017,
Microelectron. Reliab..
X. Jing,
L. Wan,
Daquan Yu,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Liqiang Cao,
Fengze Hou,
Qidong Wang,
2017,
Microelectron. Reliab..
Fengze Hou,
Guoqiang He,
Minghao Zhou,
2022,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fengchen,
Liqiang Cao,
Hengyun Zhang,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Liqiang Cao,
Fengze Hou,
Lixi Wan,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Fengze Hou,
Fengying Jiang,
Dongbo Zhang,
2023,
IEEE Transactions on Power Electronics.