Yiping Wu
发表
W. Guo,
Yinong Liu,
Jibing Chen,
2012
.
Yiping Wu,
B. An,
Huabin Chu,
2006,
2006 7th International Conference on Electronic Packaging Technology.
Yiping Wu,
B. An,
Fengshun Wu,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Yiping Wu,
B. An,
L. Ding,
2011,
2011 International Symposium on Advanced Packaging Materials (APM).
Yiping Wu,
B. An,
Yating Hu,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Hanlin Cheng,
Yiping Wu,
Haoyang Gao,
2019,
Soldering & Surface Mount Technology.
Feng Wu,
Y. C. Chan,
Y. Chan,
2008
.
Yiping Wu,
B. An,
Fengshun Wu,
2007,
2007 8th International Conference on Electronic Packaging Technology.
Yiping Wu,
Xin Chen,
2014,
2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.
Changqing Liu,
Yiping Wu,
B. An,
2015,
Journal of Electronic Materials.
Yiping Wu,
B. An,
Weiwen Lv,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
R. Hao,
Yiping Wu,
D. Fan,
2021,
Optik.
Han Ding,
Bo Tao,
Youlun Xiong,
2006,
Microelectron. Reliab..
Yiping Wu,
B. An,
Fengshun Wu,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Bin Zhao,
Yiping Wu,
B. An,
2006,
2006 7th International Conference on Electronic Packaging Technology.
Han Ding,
Yiping Wu,
Jingang Gao,
2005,
Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..
Jibing Chen,
Yiping Wu,
Yuandan Xie,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Jibing Chen,
Yiping Wu,
Juying Li,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Jibing Chen,
Yiping Wu,
Juying Li,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Jibing Chen,
Yiping Wu,
Juying Li,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Jibing Chen,
Yiping Wu,
Yanfang Yin,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Y. P. Wu,
Jibing Chen,
Yiping Wu,
2012
.
Jibing Chen,
Yiping Wu,
B. An,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Yiping Wu,
B. An,
Fengshun Wu,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Yiping Wu,
B. An,
Fengshun Wu,
2009,
2008 10th Electronics Packaging Technology Conference.
Changqing Liu,
Yiping Wu,
B. An,
2016
.
Q. Wei,
W. Xia,
Yiping Wu,
2021,
Metals.
Yiping Wu,
Jie Wu,
Huabin Sun,
2022,
Crystals.
Yiping Wu,
Wei Wang,
Wenyan Wang,
2014
.
Bin Yang,
Q. Gao,
Yiping Wu,
2016
.
Yiping Wu,
Hanqing Xiong,
Yuzhen Jia,
2021,
Journal of Magnesium and Alloys.
Yiping Wu,
Gui-sheng Gan,
Cong Liu,
2021,
Journal of Advanced Joining Processes.
Bo Zhang,
Bin Yang,
Yiping Wu,
2017,
Materials.
Yiping Wu,
X. Qiao,
Jianguo Chen,
2000
.
Weiyang Wang,
Wen-ru Sun,
Yiping Wu,
2022,
Materials Science and Engineering: A.
Yiping Wu,
Mingyu Hu,
Yiping Wu,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Changqing Liu,
Yiping Wu,
B. An,
2015,
Journal of Electronic Materials.
Jibing Chen,
Yiping Wu,
Yanfang Yin,
2015
.
Wei Guo,
Jibing Chen,
Yiping Wu,
2011,
2011 International Symposium on Advanced Packaging Materials (APM).
Yiping Wu,
B. An,
Fengshun Wu,
2011
.
Jun Zhang,
Fengshun Wu,
Bo Wang,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Fengshun Wu,
Bo Wang,
Yiping Wu,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Yiping Wu,
B. An,
Fengshun Wu,
2008,
EPTC 2008.
Yiping Wu,
B. An,
Fengshun Wu,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Weigang Zhang,
Yiping Wu,
B. An,
2006,
2006 7th International Conference on Electronic Packaging Technology.
Fengshun Wu,
Bo Wang,
Longzao Zhou,
2010
.
Yiping Wu,
Fengshun Wu,
Hui Liu,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
R. Parkin,
Changqing Liu,
Yiping Wu,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
R. Parkin,
Changqing Liu,
Yiping Wu,
2011,
2011 International Symposium on Advanced Packaging Materials (APM).
Yiping Wu,
B. An,
Fengshun Wu,
2006,
International Conference on Electronic Packaging Technology.
Yiping Wu,
Jie Wu,
G. Huang,
2023,
Journal of Materials Science: Materials in Electronics.
Wenfei Zhang,
Yiping Wu,
B. An,
2012
.
Zhifeng Wang,
Yiping Wu,
Hanqing Xiong,
2019,
Journal of Materials Engineering and Performance.
Fan Wu,
Fengshun Wu,
Bing An,
2006,
2006 7th International Conference on Electronic Packaging Technology.
Yiping Wu,
Donghua Yang,
Y. Liao,
2017
.
Yunfei Du,
Huaishan Wang,
Yiping Wu,
2016
.
P. Sun,
Yiping Wu,
Gan Guisheng,
2021
.
Rong Chen,
Yiping Wu,
B. An,
2014,
International Conference on Electronic Packaging Technology.
Yiping Wu,
B. An,
Yating Hu,
2013,
International Conference on Electronic Packaging Technology.
Shiyu Huang,
Jibing Chen,
Yiping Wu,
2023,
Materials.
Yiping Wu,
B. An,
Fengshun Wu,
2009,
2009 59th Electronic Components and Technology Conference.
W. Guo,
Wenfei Zhang,
Yiping Wu,
2012
.
Prithvi S. Kandhal,
Frazier Parker,
Yiping Wu,
1998
.
Jibing Chen,
Yiping Wu,
B. An,
2013,
2013 14th International Conference on Electronic Packaging Technology.
K. Paik,
Yiping Wu,
Y. Tian,
2020,
Materials.
Xi Liu,
Ye Tian,
Suresh K. Sitaraman,
2014,
Microelectron. Reliab..
Fengshun Wu,
Bing An,
Yiping Wu,
2009
.
C. Xie,
Yiping Wu,
X. Qiao,
1999
.