S. Shen

发表

A pplication of soft landing to the process control of chemical mechanical polishing

Cheng-Ching Yu, J. Chiu, S. Shen, 2003 .

Batch Sequencing for Run-to-Run Control: Application to Chemical Mechanical Polishing

Cheng-Ching Yu, S. Shen, Yih-Hang Chen, 2005 .

Use of biased-relay feedback for system identification

Cheng-Ching Yu, Shih-Haur Shen, Cheng-Ching Yu, 1996 .

Planarization Strategy of Cu CMP Interaction between Plated Copper Thickness and Removal Rate

Cheng-Ching Yu, J. Chiu, S. Shen, 2004 .

SERS in Sandblast Roughened Metal Surface

S. J. Lin, S. Shen, W. Tse, 1991 .

Robust operation of copper chemical mechanical polishing

Cheng-Ching Yu, Shih-Haur Shen, Cheng-Ching Yu, 2003 .

R obust operation of copper chemical mechanical polishing

Cheng-Ching Yu, S. Shen, Yi-Chung Kao, 2002 .

Selection of measurement locations for the control of rapid thermal processor

Cheng-Ching Yu, Chi-Jay Huang, Shih-Haur Shen, 2000, Autom..

Use of relay‐feedback test for automatic tuning of multivariable systems

Shih‐Haur Shen, Cheng‐Ching Yu, Cheng-Ching Yu, 1994 .

Impact of Film Morphology on Chemical Mechanical Polishing of Tungsten

Brian J. Brown, B. Swedek, S. Shen, 2016 .

Operational Aspects of Chemical Mechanical Polishing Polish Pad Profile Optimization

Cheng-Ching Yu, S. Shen, C. Chen, 2000 .

Derivation of transfer function from relay feedback systems

Cheng-Ching Yu, S. Shen, Cheng Ching Yu, 1992 .

Autotune identification under load disturbance

Cheng-Ching Yu, Shih-Haur Shen, Cheng-Ching Yu, 1996 .