Sungbum Kang

Parametric Studies of Effects of Solder Bump Pitch, Package Size, and Molding Compound and Substrate Thicknesses on Warpage of PBGA Packages

I. C. Ume, Sungbum Kang, I. Ume, 2014 .

Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards

I. C. Ume, Sungbum Kang, 2018, The International Journal of Advanced Manufacturing Technology.

Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards

I. Charles Ume, Sungbum Kang, I. C. Ume, 2018 .

Techniques for Measuring Warpage of Chip Packages, PWBs, and PWB Assemblies

Sungbum Kang, I. C. Ume, I. Charles Ume, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Determination of Optimum Values of Control Parameters to Reduce Laser Speckle Noise for Projection Moire´ System

Jie Gong, I. Charles Ume, Sungbum Kang, 2011 .

Wafer warpage analysis of stacked wafers for 3D integration

Youngrae Kim, Sungbum Kang, Sungdong Kim, 2012 .

Study of thinned Si wafer warpage in 3D stacked wafers

Sarah Eunkyung Kim, Youngrae Kim, Sung-Keun Kang, 2010, Microelectronics Reliability.

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

I. Charles Ume, Sungbum Kang, I. C. Ume, 2013 .