J. Zechner

发表

Mechanical properties and interface toughness of metal filled nanoporous anodic aluminum oxide coatings on aluminum

G. Mohanty, J. Michler, H. Cebeci, 2014 .

High resolution determination of local residual stress gradients in single- and multilayer thin film systems

H. Gänser, J. Michler, R. Brunner, 2016 .

Cross-sectional stress distribution in AlxGa1-xN heterostructure on Si(111) substrate characterized by ion beam layer removal method and precession electron diffraction

M. Petrenec, J. Zalesak, B. Sartory, 2016 .

Pulse electrodeposition of adherent nickel coatings onto anodized aluminium surfaces

J. Michler, H. Cebeci, L. Philippe, 2015 .

Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers

W. Robl, C. Mitterer, J. Keckes, 2017 .

Evaluation of the thermal stability of TiW/Cu heterojunctions using a combined SXPS and HAXPES approach

M. Nelhiebel, A. Regoutz, R. Palgrave, 2022, Journal of Applied Physics.

Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

G. Dehm, C. Kirchlechner, G. Langer, 2019 .

Addressing Fracture Properties of Individual Constituents Within a Cu-WTi-SiOx-Si Multilayer

D. Kiener, J. Zechner, M. Alfreider, 2020, JOM.

Thermal stability of immiscible sputter-deposited Cu-Mo thin films

C. Mitterer, J. Zechner, V. L. Terziyska, 2019, Journal of Alloys and Compounds.

Microstructure and physical properties of sputter-deposited Cu-Mo thin films

C. Mitterer, J. Zechner, V. L. Terziyska, 2018 .

A novel setup for wafer curvature measurement at very high heating rates.

M. Nelhiebel, R. Pippan, J. Zechner, 2017, The Review of scientific instruments.

Matching in-situ and ex-situ recorded stress gradients in an AlxGa1 − xN Heterostructure: Complementary wafer curvature analyses in time and space

B. Sartory, W. Ecker, J. Keckes, 2018 .

A measurement structure for in-situ electrical monitoring of cyclic delamination

M. Nelhiebel, M. J. Cordill, J. Zechner, 2022, Surface and Coatings Technology.

A Novel Setup for In Situ Monitoring of Thermomechanically Cycled Thin Film Metallizations

M. Nelhiebel, R. Pippan, M. J. Cordill, 2019, JOM.

Interface mediated deformation and fracture of an elastic-plastic bimaterial system resolved by in situ transmission scanning electron microscopy

D. Kiener, J. Zechner, M. Alfreider, 2022, Materials & Design.

A comparison of three different notching ions for small-scale fracture toughness measurement

J. Wehrs, J. Michler, I. Shorubalko, 2016 .

Reversible, high temperature softening of plasma-nitrided hot-working steel studied using in situ micro-pillar compression

J. Wehrs, J. Michler, J. Zechner, 2017 .

Improved oxidation resistance of TiAlN coatings by doping with Si or B

C. Mitterer, J. Zechner, M. Penoy, 2009 .

Fabrication of MEMS based structures for characterization of thin metal films by nanoindentation technique

J. Keckes, J. Zechner, J. Walter, 2018, 2018 20th International Conference on Electronic Materials and Packaging (EMAP).

Microcantilever Fracture Testing of Intermetallic Cu3Sn in Lead-Free Solder Interconnects

G. Dehm, C. Kirchlechner, J. Zechner, 2017, Journal of Electronic Materials.

Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics

G. Dehm, C. Kirchlechner, J. Zechner, 2016 .

Fatigue of copper films subjected to high-strain rate thermo-mechanical pulsing

M. Nelhiebel, J. Zechner, M. Reisinger, 2022, Microelectronics Reliability.

Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films

M. Nelhiebel, E. Kozeschnik, J. Zechner, 2021, Microelectronics Reliability.

Electropolishing—A Practical Method for Accessing Voids in Metal Films for Analyses

J. Zechner, S. Moser, Manuel Kleinbichler, 2021, Applied Sciences.

Device and Method for Measuring Interface Strength in Microstructures

H. Melzner, J. Zechner, A. Clausner, 2021 .

Micromechanical Adhesion Experiments and Simulation on Cu-Damascene Processed Test Devices

H. Melzner, J. Zechner, A. Clausner, 2023, IEEE Transactions on Device and Materials Reliability.

In-situ SEM micromechanical experiments on Dual Damascene Copper test structures for investigation of interfacial properties of copper interconnects

H. Melzner, J. Zechner, A. Clausner, 2021, 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure mechanisms in metal-metal nanolaminates at elevated temperatures: Microcompression of Cu–W multilayers

R. Raghavan, J. Michler, V. Chawla, 2015 .

Resolving alternating stress gradients and dislocation densities across AlxGa1-xN multilayer structures on Si(111)

B. Sartory, W. Ecker, J. Keckes, 2017 .

Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers

S. Wöhlert, D. Többens, M. J. Cordill, 2017 .

Capturing the Dynamics of Ti Diffusion Across TixW1−x/Cu Heterostructures using X‐Ray Photoelectron Spectroscopy

M. Nelhiebel, A. Regoutz, Tien-Lin Lee, 2023, Advanced Physics Research.

Scratch induced thin film buckling for quantitative adhesion measurements

S. Wöhlert, M. J. Cordill, J. Zechner, 2018, Materials & Design.

Small-scale fracture toughness of ceramic thin films: the effects of specimen geometry, ion beam notching and high temperature on chromium nitride toughness evaluation

J. Michler, J. Zechner, J. Wheeler, 2016 .

Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading

H. Melzner, J. Zechner, A. Clausner, 2023, Microelectronics Reliability.

Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

M. J. Cordill, J. Zechner, J. Zechner, 2017 .

Fracture mechanics of thin film systems on the sub-micron scale

T. Antretter, R. Brunner, D. Kiener, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.