W. Shih
发表
C. C. Li,
C. Chung,
W. Shih,
2014,
Metallurgical and Materials Transactions A.
Y. Lai,
W. Shih,
C. Kao,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Hao-Hsiang Chuang,
W. Shih,
C. Kao,
2014,
Journal of Electronic Materials.
C. C. Li,
C. Chung,
W. Shih,
2014
.
C. Raczkowski,
J. King,
W. Shih,
1998
.
Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing
Hao-Hsiang Chuang,
W. Shih,
C. Kao,
2012
.
J. J. Yu,
W. Shih,
C. Kao,
2014
.
W. Shih,
C. Kao,
H. Hung,
2018,
Journal of Electronic Materials.
J. J. Yu,
W. Shih,
C. Kao,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Y. Lai,
W. Shih,
C. Kao,
2013
.
W. Shih,
C. Kao,
Z. X. Zhu,
2019,
Journal of Alloys and Compounds.