C. Lee

Copper versus palladium coated copper wire process and reliability differences

A. Mawer, C. Lee, T. Tran, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Metal lift failure modes during fine pitch wire bonding low-k devices with Bond Over Active (BOA) design

C. Lee, T. Tran, Y. K. Au, 2010, 2010 12th Electronics Packaging Technology Conference.

Copper wire bonding on low-k/copper wafers with Bond Over Active (BOA) structures for automotive customers

C. Lee, T. Tran, L. Higgins, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Overview of Metal Lifted Failure Modes During Fine-Pitch Wirebonding Low K/Copper Dies with Bond Over Active (BOA) Circuitry Design

C. Lee, T. Tran, C. Miller, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

A thermal aging study on both Au-Cu and Au-Al wire-bonded interfaces

C. Lee, T. Tran, C. Yong, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Challenges of Cu wire bonding on low-k/Cu wafers with BOA structures

C. Lee, L. Higgins, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Cu/Low-k TBGA Glob Top Package Reliability Challenges

S. C. Teck, C. Lee, Lau Teck Beng, 2006, 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.

Copper Ball Voids for Pd-Cu Wires: Affecting Factors and Methods of Controlling

C. Lee, T. Tran, V. Mathew, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).