T. Tran

Copper versus palladium coated copper wire process and reliability differences

A. Mawer, C. Lee, T. Tran, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Low K CMOS65 ball grid array 47 μm pitch wire bonding process development

T. Tran, Ming-chuan Han, B. Yan, 2007, 2007 9th Electronics Packaging Technology Conference.

Metal lift failure modes during fine pitch wire bonding low-k devices with Bond Over Active (BOA) design

C. Lee, T. Tran, Y. K. Au, 2010, 2010 12th Electronics Packaging Technology Conference.

Copper wire bonding on low-k/copper wafers with Bond Over Active (BOA) structures for automotive customers

C. Lee, T. Tran, L. Higgins, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Overview of Metal Lifted Failure Modes During Fine-Pitch Wirebonding Low K/Copper Dies with Bond Over Active (BOA) Circuitry Design

C. Lee, T. Tran, C. Miller, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

A thermal aging study on both Au-Cu and Au-Al wire-bonded interfaces

C. Lee, T. Tran, C. Yong, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Packaging challenges in low-k silicon with thermally enhanced ball grid array (TE-PBGA)

T. Tran, S. Gonzales, K. Yow, 2010, 2010 12th Electronics Packaging Technology Conference.

Copper Ball Voids for Pd-Cu Wires: Affecting Factors and Methods of Controlling

C. Lee, T. Tran, V. Mathew, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads

Scott Chen, Tu Anh Tran, Lois Yong, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).