Xicheng Wei

发表

Xicheng Wei, Yongjiu Han, Fei Lin, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Wurong Wang, Xicheng Wei, Yangyang Zhao, 2021, Journal of Materials Engineering and Performance.

Wurong Wang, Xicheng Wei, Yangyang Zhao, 2022, Journal of materials engineering and performance.

Han. Dong, Chundong Hu, Xicheng Wei, 2020, Materials Research Express.

Qi Liu, Wurong Wang, Xicheng Wei, 2019, Journal of Materials Engineering and Performance.

Xicheng Wei, Renfu Quan, Junwei Wu, 2017 .

Xiao Wang, Xicheng Wei, Wurong Wang, 2018, Industrial Lubrication and Tribology.

Johan Liu, P. Sun, D. Shangguan, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

Wurong Wang, Xicheng Wei, Luhai Zhou, 2018, Acta Metallurgica Sinica (English Letters).

Xicheng Wei, Jicheng Zhang, Lin Li, 2008 .

Hongbing Wang, Xicheng Wei, Yongjiu Han, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.