I. Rasiah

Alpha radiation sources in low alpha materials and implications for low alpha materials refinement

B. M. Clark, M. Weiser, I. Rasiah, 2004 .

The effect of fillet height and bondline thickness on the mechanical performance of a plastic package

I. Rasiah, C. Breach, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Rheology of the underfill flow process in a flip chip package

I. Rasiah, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

Next Frontier in Optical Imaging Techniques for Laparoscopic Surgery: An Industry Perspective

I. Rasiah, M. Groves, 2016 .

The role of surface morphology on interfacial adhesion in IC packaging

I. Rasiah, C. Lee, R. Gopalakrishnan, 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

Thermal performance of a phase change material on a nickel-plated surface

K. Siow, I. Rasiah, Kok Siong Siow, 2004 .

Improved Ashby–Jephcott interferometer for temporal electron density measurements in plasmas

I. Rasiah, 1994 .

Voltage-current relationship for flashlamps: an empirical approach.

B. C. Tan, I. Rasiah, H. W. Lee, 1991, Applied optics.

Rheological analysis of an underfill material

P. Ho, I. Rasiah, M. Manoharan, 1998, Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).

Analysis of Phase Change Material for Use as Thermal Interface Material

K. Siow, I. Rasiah, Kok Siong Siow, 2004 .