T. Lee

发表

Wetting reaction versus solid state aging of eutectic SnPb on Cu

D. Frear, K. Tu, J. Kivilahti, 2001 .

Effects of reactive diffusion on stress evolution in Cu-Sn films

Jin Yu, J. Y. Song, T. Lee, 2004 .

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

D. R. Frear, King-Ning Tu, D. Frear, 2001 .

Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology

D. Frear, T. Lee, Jin-wook Jang, 2001 .

Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint

Jin Yu, T. Lee, J. Kim, 2004 .

Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films

Jin Yu, J. Y. Song, T. Lee, 2004 .

Structure and magnetism of atomically thin Fe layers on flat and vicinal Pt surfaces

U. Starke, A. Enders, K. Kern, 2006 .

DigitalCommons@University of Nebraska - Lincoln DigitalCommons@University of Nebraska - Lincoln Magnetism of FePt Surface Alloys Magnetism of FePt Surface Alloys

A. Enders, H. Ebert, K. Kern, 2019 .

The microstructure of aluminized type 310 stainless steel

T. Lee, H. Huang, D. Gan, 2006 .

Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction

Alastair A. MacDowell, Richard Celestre, King-Ning Tu, 2003 .

Direct DNA hybridization detection based on the oligonucleotide-functionalized conductive polymer.

Y. Shim, T. Lee, T Y Lee, 2001, Analytical chemistry.

The microstructure of siliconized type 310 stainless steel

T. Lee, D. Gan, H. L. Huang, 2006 .

Epitaxial CrN(001) Grown and Analyzed In situ by XPS and UPS. I. Analysis of As-deposited Layers

I. Petrov, D. Gall, R. Haasch, 2000 .

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

D. R. Frear, Jorma Kivilahti, King-Ning Tu, 2002 .

The effects of electroplating parameters on the composition and morphology of Sn-Ag solder

T. Lee, J. H. Lee, J. Y. Kim, 2004 .

Enhanced field emission properties of thin-multiwalled carbon nanotubes: Role of SiOx coating

Jae-Hee Han, P. Alegaonkar, T. Lee, 2006 .

Electromigration of eutectic SnPb solder interconnects for flip chip technology

D. R. Frear, King-Ning Tu, D. Frear, 2001 .

Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations

T. Lee, J. Yu, J. Yu, 2008 .

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sung K. Kang, Jin Yu, D. Shih, 2004 .

Morphological stability of solder reaction products in flip chip technology

King-Ning Tu, K. Tu, T. Lee, 2001 .

Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils

K. Tu, T. Lee, J. Jang, 1999 .

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

D. R. Frear, King-Ning Tu, Jin-Wook Jang, 2000 .

Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging

D. Frear, K. Tu, T. Lee, 2007, Journal of Materials Research.

Growth interruption studies on vertically aligned 2-3 wall carbon nanotubes by water assisted chemical vapor deposition

Jong Hak Lee, T. Lee, S. Patole, 2008 .

Study on the Li and B Co-doped diamond thin film

Jin Yu, T. Lee, W. S. Lee, 2005 .

Study of grass formation in GaAs backside via etching using inductively coupled plasma system

K. Tu, T. Lee, L. Ferreira, 2000 .

Perpendicular coupling and spin reorientation transition in FCC Fe/Cu/Fe trilayers

A. Enders, K. Kern, T. Lee, 2004 .

Strength of Perpendicular Magnetic Anisotropy at Bottom and Top Interfaces in [Pt/Co/Pt] Trilayers

S. H. Lim, T. Lee, Y. Won, 2014, IEEE Magnetics Letters.