L. Li

Wetting reaction versus solid state aging of eutectic SnPb on Cu

D. Frear, K. Tu, J. Kivilahti, 2001 .

Electrical conduction models for isotropically conductive adhesive joints

L. Li, J. Morris, 1997 .

High-lead flip chip bump cracking on the thin organic substrate in a module package

L. Li, D. R. Frear, J. W. Jang, 2012, Microelectron. Reliab..

Influence of defects on flow and mass transfer in the channel with micro-fluidic chips

Qiuwan Wang, L. Li, Jian Yang, 2017 .

Embedded passives in organic substrate for RF module and assembly characterization

L. Li, L. Li, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).