Nety M. Krishna

Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

R. Dauskardt, M. Lane, Nety M. Krishna, 2000 .

Adhesion and debonding of multi-layer thin film structures

Michael Lane, Reinhold H. Dauskardt, R. Dauskardt, 1998 .

Effect of Nitrogen Content on Interfacial Adhesion of the Ta/SiO 2 Interface

M. Lane, Nety M. Krishna, I. Hashim, 1999 .

Subcritical Debonding of Multilayer Interconnect Structures: Temperature and Humidity Effects

M. Lane, Nety M. Krishna, Q. Ma, 1999 .