I. Hashim

发表

Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

R. Dauskardt, M. Lane, Nety M. Krishna, 2000 .

Process integration of double level copper-low k (k=2.8) interconnect

D. Cheung, D. Yost, I. Hashim, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

In Situ Analysis of magnetic and Structural Properties of Epitaxial and Polycrystalline Ni 80 Fe 20 Thin Films

H. Atwater, T. Watson, I. Hashim, 1993 .

Effect of Nitrogen Content on Interfacial Adhesion of the Ta/SiO 2 Interface

M. Lane, Nety M. Krishna, I. Hashim, 1999 .

TEM Analyses Of Cu-Ta And Cu-Tan Interfaces

Fusen E. Chen, G. Dixit, I. Hashim, 1999 .

Agglomeration Of Cu Electroplating Seed Layers On Ultra-Thin Ta, Ta 1-x N x , Ta l-x O x , Contaminated Ta, and Composite Ta/Ta 1-x N x Diffusion Barriers

H. Atwater, I. Hashim, J. W. Hartman, 1999 .

In situ magnetic and structural analysis of epitaxial Ni80Fe20 thin films for spin‐valve heterostructures

H. Atwater, I. Hashim, 1994 .

Evolution of structural and magnetic properties in Ta/Ni81Fe19 multilayer thin films

H. Atwater, I. Hashim, R. Valletta, 1993 .

Interdiffusion Kinetics and Magnetic Properties of TA-Permalloy Multilayers

H. Atwater, I. Hashim, R. Valletta, 1991 .

Barrier and seed layers for damascene copper metallization

Fusen E. Chen, Peijun Ding, Barry Chin, 1998 .

Epitaxial growth of Cu (001) on Si (001): Mechanisms of orientation development and defect morphology

H. Atwater, Byungwoo Park, I. Hashim, 1993 .

Orientational and Microstructural Evolution During Epitaxial Growth of Cu on Si(001) by Sputter Deposition

H. Atwater, I. Hashim, B. Park, 1992 .

(100) Epitaxial and (111) Polycrystalline Spin Valve Heterostructures on si (100): Magnetotransport and the Importance of Interface Mixing in Ion Beam Sputtering

H. Atwater, T. Watson, I. Hashim, 1995 .

Ambient Dependence of Agglomeration Stability of Cu/Ta Films

Fusen E. Chen, H. Atwater, I. Hashim, 1998 .

IMP Ta/Cu seed layer technology for high-aspect-ratio via fill by electroplating, and its application to multilevel single-damascene copper interconnects

Vikram Pavate, Peijun Ding, Barry Chin, 1998, Advanced Lithography.