B. Ekstrom

发表

STM atomic-scale characterization of the γ′-Al2O3 film on Ni3Al(111)

S. Addepalli, B. Ekstrom, N. P. Magtoto, 1999 .

STM, LEED and AES studies on the oxidation of a CrN overlayer on Fe0.8Cr0.2(100)

B. Ekstrom, J. Lin, J. Kelber, 1997 .

The Effect Of Surface Oxides On Cu/Ta Interfacial Interactions

B. Ekstrom, J. Kelber, L. Chen, 1999 .

Effect of surface impurities on the Cu/Ta interface

B. Ekstrom, N. P. Magtoto, J. Kelber, 2000 .

Advanced CVD Barrier Technology for Copper Interconnect

Ajay Jain, M. Herrick, B. Ekstrom, 1999 .

Cu wetting and interfacial stability on clean and nitrided tungsten surfaces

S. Lee, B. Ekstrom, N. P. Magtoto, 2001 .

Interactions at the Al-S-Fe Interface: S Inhibition of Aluminum Oxidation

S. Addepalli, B. Ekstrom, J. Lin, 1999 .

Dielectric breakdown of ultrathin aluminum oxide films induced by scanning tunneling microscopy

S. Addepalli, B. Ekstrom, N. P. Magtoto, 2000 .

Process Evaluation and Characterization of Tungsten Nitride as a Diffusion Barrier for Copper Interconnect Technology

B. Ekstrom, 2005 .

S-Induced Destabilization of Aluminum Oxide at the Fe(poly)–S–Al2O3 Interface

S. Addepalli, B. Ekstrom, N. P. Magtoto, 2000 .