S. Chungpaiboonpatana
发表
K. Okuyama,
F. Shi,
A. Mikrajuddin,
1999
.
H. K. Kim,
F. Shi,
S. Chungpaiboonpatana,
2000
.
Kwan Ling Tan,
Ming-Yuan Cheng,
Ramona Damalerio,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Leong Yew Wing,
S. Chungpaiboonpatana,
H. Li,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
M. Abdullah,
K. Okuyama,
F. Shi,
1999,
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
F. Shi,
S. Chungpaiboonpatana,
G.P. Lip,
2004,
9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..
M. Abdullah,
K. Okuyama,
F. Shi,
1999,
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
S. Chungpaiboonpatana,
F.G. Shi,
F. Shi,
2004,
IEEE Transactions on Advanced Packaging.
Frank G. Shi,
Kikuo Okuyama,
S. Chungpaiboonpatana,
1999
.
Frank G. Shi,
H. K. Kim,
S. Chungpaiboonpatana,
2000,
SPIE Advanced Lithography.
F. Shi,
S. Chungpaiboonpatana,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..