H. Pang
发表
X. Shi,
Wei Zhou,
H. Pang,
1998,
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).
Z. P. Wang,
K. Tan,
X. Shi,
2001
.
Z. P. Wang,
X. Shi,
H. Pang,
2003
.
Z. P. Wang,
X. Shi,
Wei Zhou,
1999
.
Y. S. Chen,
H. Pang,
T. L. Tan,
1997,
Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).
F. Che,
Wei Sun,
H. Pang,
2006,
2006 7th International Conference on Electronic Packaging Technology.
F. Che,
H. Pang,
A. Sun,
2006
.
F. Che,
H. Pang,
2005,
2005 7th Electronic Packaging Technology Conference.
Z. P. Wang,
X. Shi,
X.Q. Shi,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Z. P. Wang,
X. Shi,
X.Q. Shi,
2000,
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
V. Annamdas,
C. Soh,
H. Pang,
2013
.
Wei Zhou,
H.L.J. Pang,
Z. P. Wang,
2002
.
Wei Zhou,
H.L.J. Pang,
Z. P. Wang,
1999
.
Fook Fah Yap,
Rongming Lin,
H.L.J. Pang,
2000
.
Xunqing Shi,
Z. P. Wang,
H.L.J. Pang,
2002
.
X.Q. Shi,
H. Pang,
Z.P. Wang,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
H. Pang,
W. Zhou,
2006
.
S. L. Ngoh,
X.Q. Shi,
A. Spowage,
2004,
Electronic Packaging Technology Conference.
Wei Zhou,
H.L.J. Pang,
X.Q. Shi,
2000,
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
H.L.J. Pang,
Wei Zhou,
Z. P. Wang,
2000
.
X.Q. Shi,
H. Pang,
Z.P. Wang,
1998,
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).
W.H. Zhu,
A.Y.S. Sun,
H.L.J. Pang,
2006,
2006 8th Electronics Packaging Technology Conference.
H.L.J. Pang,
Xunqing Shi,
X.R. Zhang,
2004,
IEEE Transactions on Components and Packaging Technologies.
K. H. Ang,
X.Q. Shi,
H. Pang,
2000,
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
H.L.J. Pang,
S. Mhaisalkar,
H. Pang,
1996,
1996 Proceedings 46th Electronic Components and Technology Conference.
H. Pang,
T. Tan,
G. Lim,
1997,
Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).
H. Pang,
H. L. Pang,
S. R. Pukas,
1989
.
H. Pang,
C. Seetoh,
1997
.
Fook Fah Yap,
R. M. Lin,
H.L.J. Pang,
1997,
Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).
H.L.J. Pang,
H. Pang,
1993
.
S. Mhaisalkar,
H. Pang,
A. Yeo,
1996
.
H.L.J. Pang,
H. Pang,
1995
.
H. Pang,
H.L.J Pang,
1994
.
Z. P. Wang,
X. Q. Shi,
H. L. J. Pang,
2000
.
Wei Sun,
W.H. Zhu,
C.K. Wang,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
Wei Zhou,
Z. P. Wang,
X. Q. Shi,
2000
.
H.L.J. Pang,
X. R. Zhang,
X. Shi,
2002
.