Petar Ratchev

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

Serguei Stoukatch, Petar Ratchev, Bart Swinnen, 2006, Microelectron. Reliab..

Creep as a reliability problem in MEMS

Robert Puers, Ingrid De Wolf, Ann Witvrouw, 2004, Microelectron. Reliab..

Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

A study of the bainitic transformation in an intercritical annealed TRIP-assisted steel

Pascal Jacques, Petar Ratchev, Bert Verlinden, 1999 .

Direct gold and copper wires bonding on copper

Eric Beyne, Wai Lam, Serguei Stoukatch, 2003, Microelectron. Reliab..