Wei Long

Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling

Mu-lan Li, Li-li Gao, Liang Zhang, 2021, Journal of Materials Research and Technology.

Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties

Mu-lan Li, Liang Zhang, Wei Long, 2022, Materials & Design.