P. Towashiraporn

Power cycling thermal fatigue of Sn–Pb solder joints on a chip scale package

K. Gall, G. Subbarayan, B. Hunter, 2004 .

Cohesive Modeling of Solder Interconnect Failure in Board Level Drop Test

P. Towashiraporn, P. Towashiraporn, C. Xie, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces

Ganesh Subbarayan, P. Towashiraporn, C. Desai, 2005 .

Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests

Ganesh Subbarayan, P. Towashiraporn, B. McIlvanie, 2002 .

A hybrid fracture-damage model for computationally efficient fracture simulations in solder joints

P. Towashiraporn, P. Towashiraporn, G. Subbarayan, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).